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| UFS 5.0 Is Nearing Completion, Will Deliver Astounding Performance Gains Of Up To 10.8GB/s |
10/9/2025 |
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Current-generation smartphones are equipped with a slightly improved variation of the UFS 4.0 standard, which is UFS 4.1, but eventually these devices transition to the significantly improved UFS 5.0 technology, which JEDEC states is nearing completion. Not only will the newer flash memory enable increased performance on mobile computing products such as smartphones and tablets, but the new standard will also reduce power consumption.
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| Intel, Nvidia could use unified memory for AI PCs |
10/9/2025 |
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Nvidia's $5 billion investment in Intel is expected to create x86 system-on-chips that integrate Nvidia's graphics processing unit chiplets, potentially leading to AI PC dominance. The partnership hints at unified memory architecture, similar to Apple Silicon, which would allow central processing units and GPUs to share a pool of RAM, overcoming the VRAM limitation that currently hampers AI workloads.
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| Qualcomm faces $647M lawsuit in UK over chip royalties |
10/8/2025 |
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A British consumers' association that goes by the name of Which? is bringing the case and its lawyers say around 29 million people who bought iPhones or Samsung devices since 2015 are entitled to compensation.
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| Fujitsu, Nvidia partner to develop AI agent platform |
10/8/2025 |
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Fujitsu and Nvidia have formed a partnership to accelerate industrial AI adoption by combining the Fujitsu-Monaka central processing unit and Nvidia's graphics processing unit via NVLink Fusion, as well as co-developing self-evolving AI agent platforms for sectors such as health care, manufacturing and robotics.
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| Foxconn sees record Q3 revenue of $67.71B |
10/7/2025 |
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Foxconn's shares have risen 23 per cent this year, outperforming the 16 per cent rise for the Taiwan market. The stock closed up 0.44 per cent on Friday ahead of the revenue data release, compared with a 1.45 per cent gain for the benchmark index.
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| Siemens debuts software for analog IC testing |
10/6/2025 |
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Siemens Digital Industries Software has introduced Tessent AnalogTest, a module for the Tessent Silicon Lifecycle Solution that the company claims can test analog circuitry in ICs up to 100 times faster than traditional testing methods.
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| Altman met with TSMC, Foxconn about AI chip supply |
10/3/2025 |
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OpenAI CEO Sam Altman has visited Taiwan and South Korea to secure chip supplies and data center partnerships, according to reports. Altman reportedly met with executives from Taiwan Semiconductor Manufacturing Co. and Foxconn to discuss chip design, manufacturing, and AI server infrastructure, which are vital for OpenAI's Stargate initiative.
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