Thursday, December 2, 2021

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Several board-level members resigned at China SMIC 11/15/2021
The company is no stranger to top-level shakeups in recent years. In December 2020, the Shanghai-based chip maker appointed Chiang to the same positions from which eleven months later he has resigned — executive director, vice chairman and member of the strategic committee. SMIC indicated last December that co-CEO Liang might resign.
Broadcom Software Group beats estimate 11/12/2021
Broadcom Software has more than 3,200 patents, and about 80% of its workforce is dedicated to R&D efforts. The company invests about 14% of its revenue into R&D.
DRAM prices to pull back after 8 months of increase 11/12/2021
PC and server manufacturers purchased large quantities of DRAM in the first half of 2021 to help alleviate potential manufacturing and shipping delays later in the year. They are expected to curtail their high level of DRAM purchases in 4Q21 in order to burn through existing inventory. PC and server DRAM prices are expected to slip 0-5% in 4Q21.
Lattice offers AI driven power saving 11/12/2021
Lattice has debuted reference designs for power saving in laptops to improve battery life. One technique, attention tracking, could potentially extend battery life by an estimated 28 percent.
MediaTek claims to be the largest smartphone SoC maker globally 11/12/2021
The company that sells chips to every smartphone maker. Apple now offers its Dimensity line of processors for the high-end “flagship” segment of the sector.
Samsung to switch to LPDDR5X productions 11/11/2021
The LPDDR5X consumes 20 percent less energy compared to the previous DDR5 used for mobile products, according to the company in a statement.
Semiconductor manufacturers now require up-front capex contributions and uncancellable orders 11/11/2021
UMC asked customers for the $3.5 billion cost of a new fab. GloFo and NXP came up with the concept of orders which could not be cancelled. Microchip, where orders are 50% more than it can supply, offered priority delivery to customers who signed orders which couldn’t be cancelled or changed for a year.
Toshiba is set to divide itself into three companies 11/11/2021
Toshiba is to focus on infrastructure, devices, and semiconductor memory as early as 2023, this is part of Toshiba's strategy to strengthen shareholder value by creating independent companies that have different profit structures and growth strategies.
NXP works with Ford to provide enhanced driver experiences 11/11/2021
Ford’s new fully networked vehicle architecture implements NXP’s vehicle networking processors and the i.MX 8 Series processors, working together to upgrade vehicles that help improve customer lifestyle and streamline the ownership experience.
TSMC Japan to get $500 million investment from Sony 11/10/2021
TSMC would build a $7 billion chip plant in Japan with Sony Group (6758.T), a move that was welcomed by the Japanese government.
Tessolve to provide design implementation services to GlobalFoundries 11/10/2021
Tessolve will collaborate with GF to design and develop silicon solutions including Application Specific Integrated Circuits (ASICs), System-on-Chip (SoCs) solutions and test chips, etc.
Wafer area shipments grew by 16.4% in Q3 11/10/2021
Worldwide silicon wafer shipments increased 3.3% to 3,649 million square inches in the third quarter of 2021 compared to the previous quarter, a new industry record, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry.
Foxconn wants be the global driver for software ecosystem 11/10/2021
Hon Hai Technology Group (Foxconn) plans to establish a software R&D center with over 1,500 talents across Hon Hai, with the intent to recruit over 1,000 more software development engineers in the next three years.
Intel now wants to compete in the foundry business 11/9/2021
Gelsinger has an ambitious roadmap to catch and surpass Samsung and TSMC by 2025. Key to the plan is a series of massive new chip fabrication plants, or fabs, that Intel is building in the U.S., Europe and Israel. Combined, they will cost more than $44 billion to build.
Season Group, an ODM manufacturer plans major expansion in China and in Mexico 11/9/2021
The expansion aims to increase Season Group’s operational capabilities for the coming year in response to rising demands for design engineering services, the International Procurement Office.
Amkor Technology to expand package plant in Vietnam 11/9/2021
This is a strategic, long-term investment in geographical diversification and factory capacity expansion, supporting the company’s commitment to reliable supply chain solutions for our customers.
Internet of cars perhaps represent the most advancement inn silicon 11/9/2021
The entire car is being overhauled, this time with electronics, to re-make cars as supercomputers on wheels.
Texas Instruments (TI) introduced new bidirectional buck/boost converter with ultra-low quiescent current 11/8/2021
The TPS61094 integrates a buck mode for supercapacitor charging while providing ultra-low IQ, enabling engineers to extend battery life by as much as 20% when compared to commonly used hybrid-layer capacitors (HLCs).
Qualcomm lines up multiple foundry supplier sources 11/8/2021
Qualcomm CEO Cristiano Amon said on Wednesday that it expected its own supply issues to be materially better by the end of December and the company will have enough supply to meet demand by the second half of next year.
U.S. State Department cyber bureau seeks to train diplomats in cybersecurity techniques 11/8/2021
“We want to prevent cyber-attacks that put our people, our networks, companies and critical infrastructure at risk. We want the internet to remain a transformative force for learning, for connection, for economic growth, not a tool of repression.”
Is Solid-state battery to replace lithium-ion batteries in EV 11/8/2021
While Li-ion power sources have made strides in terms of cost and power density and driving range, solid-state alternatives promoted at this week’s Web Summit promise to offer improved performance and greater safety.
6G Summit launched the hype cycle for the new technology earlier than ever before 11/5/2021
As best we know right now, 6G network will arrive around the turn of the next decade. Like 3G, 4G, and 5G before it, the next generation of cellular will change over in 2030 or thereabouts.
Tencent disclosed its own custom chip design 11/5/2021
This is the first time the Chinese internet giant has publicly spoken about its progress in semiconductors.
ADI now certified to have met automotive Cyber security standard 11/5/2021
Analog Devices Inc.’s engineering processes are now certified as compliant with ISO/SAE 21434:2021, the new automotive cybersecurity standard for production road vehicle electrical and electronic (E/E) systems. This standard focuses on the end-to-end lifecycle for cybersecurity relevant E/E solutions from component to vehicle level.
Apple hit record sales regardless of short supply 11/5/2021
Apple CEO Tim Cook said robust demand fueled record sales totaling $83.4 billion during the iPhone maker’s most recent financial quarter. Revenue soared 29 percent from the same period a year ago despite worsening supply disruptions
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