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South Korea announces emergency support for auto sector against US tariffs 4/11/2025
The measures include more financial support, tax breaks and subsidies for carmakers
SpaceX Offers Free Starlink Dishes to Drive Growth Outside US 4/11/2025
The offer has been spotted in Australia and Italy for users who commit to a one-year contract.
Global Chip Sales Up 17% in February 4/10/2025
Global semiconductor sales reached $54.9 billion in February 2025, up by 17.1% year-on-year but down by almost 3% from the previous month.
Infineon to Acquire Marvell’s Automotive Ethernet Business 4/10/2025
Infineon is accelerating the build-up of its system capabilities for SDVs with the acquisition of Marvell's Automotive Ethernet business.
Altera University Launched to Equip Students with Industry-ready FPGA Skills 4/10/2025
Altera University aims to affordably and easily introduce students to the world of FPGAs and digital logic programming tools.
Siemens Expands PCB Design-to-Manufacturing Flow with DownStream Technologies Acquisition 4/10/2025
The acquisition strengthens Siemens' PCB design portfolio and expands its footprint in the electronics small and medium-sized business market.
6G Gaining Further Traction 4/9/2025
The global race for the next generation of wireless technology is officially underway.
New Design Means SpaceX Can Launch More Starlink Satellites at a Time 4/9/2025
The company's new 'V2 Mini Optimized' satellite is 22% lighter than the earlier model, enabling the Falcon 9 rocket to carry more Starlink sats into orbit.
IBM launches new mainframe system to handle heavy workload of AI models 4/9/2025
The new z17 mainframe enables a chunk of business data to remain on customer-owned servers and not hosted on the cloud
FMC, Neumonda introduce DRAM+ technology 4/9/2025
Ferroelectric Memory Co. has partnered with Neumonda to produce DRAM+, a nonvolatile memory using ferroelectric hafnium oxide, in Germany. The technology combines DRAM performance with solid-state drive-like data retention, targeting applications in AI, automotive and industrial sectors. Neumonda will support with advanced testing systems, aiming to revive semiconductor capabilities in Europe.
YMTC patents highlight advances in 3D NAND technology 4/8/2025
Yangtze Memory Technologies has published almost 20 patents for processes to enhance computing efficiency and optimize chip stacking, showcasing its technological prowess in 3D NAND. The patents include innovations in stacking structures, electromagnetic interference shielding and data refreshing methods
GUC debuts HBM4 IP with advanced monitoring 4/8/2025
Global Unichip has completed the first tape-out of an HBM4 controller and PHY IP, using Taiwan Semiconductor Manufacturing Co.'s N3P process and CoWoS-R packaging. The HBM4 IP supports data rates up to 12 Gbps, offering 2.5 times the bandwidth of HBM3, and integrates proteanTecs' monitoring for enhanced reliability.
US Investment Accelerator seeks to revamp CHIPS deals 4/8/2025
President Donald Trump has signed an executive order to create the US Investment Accelerator, aiming to negotiate better deals under the CHIPS and Science Act. Commerce Secretary Howard Lutnick will oversee the initiative, which could alter environmental protections and increase private contributions for fab construction.
American Battery reports production milestone, land sale 4/8/2025
American Battery said it has reached key recycling milestones and plans to sell 12 acres of property for $6.75 million to help fund the next phase of producing battery-grade critical minerals.
UMC Inaugurates New Fab in Singapore 4/7/2025
The new facility is equipped for manufacturing with UMC's 22nm and 28nm solutions – the most advanced foundry processes currently in Singapore's semiconductor sector.
Trump Warns Foreign Chip Makers: Your Tariffs Are 'Starting Very Soon' 4/7/2025
Semiconductors are exempt under Trump's initial round of reciprocal tariffs, but not for long, the president tells reporters on Air Force One today.
Low-Power Bluetooth SoC Fits Automotive Applications 4/7/2025
The Bluetooth Low Energy 5.3 chip, developed by Renesas, not only cuts power consumption, but it helps lower an EV’s weight by eliminating sensor wires.
Intel, TSMC plan US manufacturing JV 4/7/2025
Intel and Taiwan Semiconductor Manufacturing Co. have reportedly reached a preliminary agreement to form a joint venture to operate Intel's US fabs, with TSMC owning 20%, according to The Information. The US government is said to have influenced the deal to stabilize Intel amid operational challenges.
Aluminum cans, beer imports subject to 25% tariffs 4/4/2025
The higher costs will get passed down to consumers, according to several trade associations. The Consumer Brands Association calls for the administration to “fine-tune their approach.”
Russian spy infiltrates ASML and NXP to steal technical data necessary to build 28nm-capable fabs 4/4/2025
German A. is accused of supplying Russia with confidential technical materials from ASML, GlobalFoundries, NXP, TSMC, and GlobalFoundries, including semiconductor production manuals and various chipmaking machines. The investigators reportedly found that he obtained 105 internal documents from ASML and 88 files related to TSMC.
AMD closes ZT Systems acquisition, eyes end-to-end AI offerings 4/4/2025
CEO Lisa Su says the deal addresses the need for comprehensive AI solutions, integrating hardware, software and systems. Former ZT executives Frank Zhang and Doug Huang have joined AMD to lead manufacturing divestiture and data center platform engineering.
Taiwan tariff to spare semiconductors 4/4/2025
The White House has clarified that a 32% import tariff on Taiwan will not apply to semiconductors. News of the tariff initially caused concern for companies such as Nvidia, Qualcomm, and Advanced Micro Devices, which rely on Taiwan Semiconductor Manufacturing Co
China’s First “100% Localized” Server Makes Its Debut 4/3/2025
China's Loongson Has Managed To Develop Industry's First In-House Server, Featuring a Native Interconnect Technology as Well
Altera starts production shipments of the Agilex 7 FPGA M-series 4/3/2025
Altera has begun production shipments of the Agilex 7 FPGA M-series, which includes integrated high-bandwidth memory and DDR5 and LPDDR5 support. The field-programmable gate array, which offers over 3.8 million logic elements, is designed for applications requiring high performance and memory bandwidth, such as AI, 5G infrastructure and data centers.
Intel CEO Tan sees equal priority on both design and foundry 4/3/2025
Intel CEO Lip-Bu Tan has affirmed a commitment to maintaining Intel's dual focus on chip design and foundry services, addressing concerns about potential changes. Tan highlighted plans for domestic production in line with government initiatives, discussed product milestones and outlined plans to retain and recruit top engineering talent.
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