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| Smaller Surface PCs may arrive soon with Snapdragon chips inside |
3/28/2025 |
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Microsoft is reportedly preparing to launch a new line of smaller Surface devices, including a Surface Pro tablet and Surface Laptop, potentially in alignment with its 50th anniversary. It is speculated the 12-inch devices will feature Snapdragon chips, maintaining Microsoft's use of the Qualcomm Snapdragon X platform for consumer products.
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| Broadcom, Astera tackle PCIe 6.0 complexity for AI |
3/28/2025 |
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Broadcom and Astera Labs are addressing the complexities of PCIe 6.0, which is driven by AI workloads. Broadcom has introduced a PCIe 6.0 portfolio, including an Interop Development Platform, and is collaborating with Micron and Teledyne LeCroy. Astera Labs has expanded its Cloud-Scale Interop Lab to test Scorpio Smart Fabric switches.
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| Foundry 2.0 to grow 11% this year |
3/27/2025 |
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The Foundry 2.0 market — defined as encompassing foundry, non-memory IDM, OSAT, and photomask making —is projected to reach a market size of $298 billion in 2025, with year-over-year growth of 11%.
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| Samsung, SK Hynix compete for HBM4 dominance |
3/26/2025 |
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Samsung Electronics and SK Hynix will compete for dominance in the high-bandwidth memory market this year, aiming to strengthen their positions in the AI chip sector. SK Hynix has showcased a prototype of the 12-layer HBM4 at GTC 2025 and plans mass production in the second half of the year. Samsung has moved up its HBM4 launch by six months and plans to start mass production in the second half as well.
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| SK Hynix releases HBM4 samples, with eye on mass production this year |
3/25/2025 |
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According to the chipmaker, it recently provided samples of its 12-layer HBM4 to major clients for qualification tests. HBM4 is the sixth generation of HBM, which plays a critical role in accelerating processes for graphics processing units (GPUs) and other AI accelerator chips.
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| TSMC 2nm yields nearly ready for mass production |
3/25/2025 |
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Taiwan Semiconductor Manufacturing Co. is close to mass-producing 2-nanometer chips, with potential output reaching 50,000 wafers per month by year-end. TSMC's fabs in Baoshan and Kaohsiung in Taiwan, at full capacity, can run 80,000 wafers per month, which would meet initial demand.
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| Imec, Zeiss extend partnership for sub-2nm semiconductor R&D |
3/24/2025 |
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Imec, the research and innovation hub, and ZEISS Semiconductor Manufacturing Technology (SMT), a technology company that specialises in optoelectronics and is a supplier of key components for microchips, are intensifying their collaboration.
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| Micron, SK Hynix, Samsung debut SOCAMM |
3/24/2025 |
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Micron Technology, SK Hynix and Samsung Electronics have introduced small outline compression attached memory modules using LPDDR5X, targeting AI and low-power servers. These modules, debuting with Nvidia's GB300 Grace Blackwell Ultra Superchip systems, offer up to 128GB capacity and lower power consumption compared with DDR5.
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| Foxconn launches own AI model |
3/13/2025 |
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The “FoxBrain” large language model was initially designed to support the contract electronics manufacturer’s in-house functions, including data analysis, reasoning and problem solving.
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