Thursday, December 2, 2021

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Industry News
Renesas and OmniVision have jointly developed an integrated HD automotive camera system 9/21/2021
Renesas' Automotive HD Link (AHL) technology transmits high-definition video over low-cost cables and connectors. The AHL components in the design pair with OmniVision’s OX01F10 1.3MP SoC, which provides the industry’s best imaging performance across a wide range of challenging lighting conditions, along with the most compact form factor and lowest power consumption.
TSMC's wafer price hike reflects the tightness of supply 9/21/2021
With the latest notices to its customers, TSMC will raise its wafer prices across the main nodes mainly from the beginning of 2022. The company has maintained its wafer prices for quite a long time when compared with its smaller competitors. The change in its pricing strategy from 2022 implies not only stronger market demand going forward, but also that the capacity tightness will persist in the next few quarters.
Arm delivers a new software architecture for the future of automotive 9/21/2021
Arm, in collaboration with leaders across the automotive supply chain, is delivering a new software architecture and reference implementation, Scalable Open Architecture for Embedded Edge (SOAFEE), and two new reference hardware platforms to accelerate the software-defined future of automotive.
5G in Asia stands ready to benefit from its data-rich environment conditions 9/21/2021
Urbanized population centers, its dense transit hubs, and its extensive manufacturing infrastructure. In such a data-rich environment, 5G’s higher speeds and capacities, greater responsiveness, and lower per-bit data transmission costs will bring about greater connectivity and many new applications throughout the region.
Silicon Motion invests in startup AI company 9/20/2021
Silicon Motion intends to build a strategic partnership with Deep Vision, which has patented AI processors to perform real-time video analytics and provide natural language processing (NLP)pabilities for a growing market of voice-controlled applications
MediaTek is paying handsome recruiting bonus to new telents 9/20/2021
MediaTek offers high bonuses to poach professional designers from other companies, with those who register in October-December to work at the company to receive an early-registration bonus of NT$150,000 (US$5,415) to NT$250,000, depending on their seniority, according to industry sources.
WD/ Kioxia merger could possibly lead to new fabs in Japan and the U.S. 9/20/2021
"If Kioxia ties up with a foreign company, in particular an American company, then at the very least it will be necessary to have equal bases of operations in both countries."
Infineon opened its 300mm thin wafers fab for power chips in Austria 9/20/2021
At €1.6 billion, the investment made by the semiconductor group represents one of the largest such projects in the microelectronics sector in Europe. The Villach site is one of the world’s most modern fabs and was opened by Infineon
Qualcomm to have GlobalFoundries fabricate front-end devices 9/17/2021
"Our strong collaboration with Qualcomm Technologies includes sub-6GHz to unlock everyday access to 5G, and cutting-edge mmWave technology to take 5G to the next level by delivering unmatched data speeds while continuing to provide the longest possible battery life for smartphones."
Nvodoa's Jensen Huang named by TIME magazine as one of the 100 leading influential people 9/17/2021
In 2003, amid great skepticism, Huang directed his company Nvidia to adapt chips designed to paint graphics on computer screens, known as graphics processing units or GPUs, to perform other, more general-purpose computing tasks.
India smartwatch shipment doubles 9/17/2021
India’s smartwatch shipments more than tripled in the second quarter of 2021 compared to the same period last year, with 206% year-on-year (YoY) and 18% quarter-on-quarter (QoQ) growth during the quarter.
China is working extra hard towards semiconductor self sufficient 9/17/2021
SMIC announcement last week of an $8.9 billion investment in a new fab in Shanghai that will deploy 28nm technology.
Silicon Laboratories regroups on IoT devices after spin off automotive division 9/16/2021
Silicon Laboratories Inc introduced new chips and software to deepen its pursuit of the internet-of-things (IoT) market after completing a spinoff of several business units earlier this year.
Top fabless companies in the world saw their second-quarter revenue jump by 60% 9/16/2021
Chip producers remained unable to meet global demand, with total revenue reaching US$29.8 billion (NT$824.82 billion) for the second quarter, a year-on-year rise of 60.8%, TrendForce said.
European Commission announce a new chipmaking "ecosystem", to keep the EU competitive 9/16/2021
"We will present a new European Chips Act. The aim is to jointly create a state-of-the-art European chip ecosystem, including production. That ensures our security of supply and will develop new markets for ground-breaking European tech."
Apple‘s new A15 Bionic processor hosts 15 billion transistors 9/16/2021
The processor is built in a 5-nanometer manufacturing node and it is 50% faster than the competition in central processing unit (CPU) performance.
Conventional memory will be sufficient for Ubiquitous AI applications 9/15/2021
Not every machine learning and inference task will require advanced memory technology. Instead, proven conventional memories can handle AI at the edge, and distributed AI could be exactly what 5G needs to really shine.
TSMC to build new plant south side of the Taiwan Island 9/15/2021
The TSMC facility is expected to produce 7-nm and 6-nm chips, which are currently used for mobile, computing, and graphics processors for AMD, Nvidia, and MediaTek. Construction could start as soon as next year, although the facility will not be up and running until 2023 or 2024.
Global semiconductor equipment market to reach $100 billion 9/15/2021
Powered by digital transformation and other secular technology trends, global semiconductor equipment investments for front end fabs in 2022 are expected to reach nearly $100 billion to meet soaring demand for electronics after topping a projected $90 billion this year, both new records.
Synopsys has new president and COO 9/15/2021
Synopsys Inc. has appointed Sassine Ghazi as president and chief operating officer, effective November 1, 2021. Chi-Foon Chan will transition from his co-CEO position over the first half of fiscal 2022, after which he will continue to support the company’s long-term success in a new role.
Chinese computer manufacturer, Ramaxel, selects Onsemi as chipset partner 9/14/2021
“As an emerging leader in the fast-growing cloud market, we must have confidence in our suppliers. onsemi has become a strategic partner for us due to their superior quality, innovation, efficiency, technical support and supply capabilities that enabled us to streamline our development process and prepare for high volume production,”
Hon Hai makes auto chip with 40nm process 9/14/2021
Chen Wei-ming , head of Hon Hai’s semiconductor business group, said the company was using TSMC’s 40-nanometer process for ECU production.
Q3 outlook robust for Semiconductor Industry 9/14/2021
Also, the big three memory IC suppliers—Samsung, SK Hynix, and Micron—are each expected to post a 10% increase and Kioxia is anticipated to show an 11% jump in 3Q21 sales as demand remains strong for memory in data center servers, enterprise computing, and for 5G smartphones and related infrastructure.
TSMC to raise 1 billion dollar bond for expansion 9/14/2021
A TSMC board meeting held on Friday saw the greenlight given to the bond sale after the chipmaker announced in August that it would sell US$1 billion worth of bonds on Taiwan's international bond section of the over-the-counter (OTC) market.
New available bendable RAM for flexible processor systems 9/13/2021
Researchers at Stanford University report developing a flexible phase-change memory device, which doesn't need power in its state. While other memory chips have been made flexible, there was still a power issue in operating the memories.
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