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Industry
News
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Top 5 IC Equipment Makers’ Revenue Down 1% YoY in 2023
Out of these five WFE vendors, ASML and Applied Materials managed to post YoY growth in 2023 while Lam Research, Tokyo Electron and KLA’s revenues declined by 25%, 22%, and 8% YoY, respectively. Strong DUV and EUV sales drove ASML to the top position in 2023.
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3M appoints new CEO
The manufacturing giant named former L3Harris Technologies CEO William Brown as its chief executive, effective May 1.
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Chipmakers focus on growing talent with apprenticeships
Taiwan Semiconductor Manufacturing Co. and NXP Semiconductor are scaling up apprenticeship programs to fill the skills gap as more chip facilities are built in the US. The National Institute for Innovation and Technology, which is contracted by the Labor Department to expand apprenticeships in the semiconductor industry and related supply chain, is active in 22 states and is working on a national network of training providers.
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Swisscom to buy Vodafone Italia for 8 billion euros
Swisscom said it will buy Vodafone Italia for 8 billion euros and merge the business with its Italian subsidiary Fastweb. The deal will create Italy's second-biggest fixed-line broadband operator behind TIM, with a strong presence in the prized business segment.
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Enterprise SSD revenues surged 47.6% in Q4
Prices surged, lifting Q4 revenues by 47.6% compared with Q3 to $23.1 billion. SK Group (SK Hynix + Solidigm), Samsung Electronics and Micron Technology topped the sales ranking
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AI chip race: Samsung reportedly turns to MUF tech
Samsung Electronics is going to use the molded underfill chipmaking technique for its high bandwidth memory chips ad interest in generative AI heats up, sources say. Rival SK Hynix made the switch to mass reflow molded underfill to address production issues with non-conductive film.
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Hyundai developing auto chips on 5nm process
Hyundai Motor is designing auto chips based on the 5-nanometer process for advanced driver assistance systems in software defined vehicles, according to one report. Hyundai is said to be working with design solution providers and is expected to collaborate with Samsung Electronics or Taiwan Semiconductor Manufacturing Co.
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