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| Micron signals extended DRAM shortage |
1/13/2026 |
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Micron Technology has responded to criticism about discontinuing its consumer brand Crucial, emphasizing its ongoing support for consumers through partnerships with original equipment manufacturers. Micron also warns that improvements in DRAM supply will not occur until at least 2028, as new facilities become fully operational.
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| Arm launches 'Physical AI' unit, joining rush to robotics by tech and automakers |
1/12/2026 |
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The decision to create a unit that specializes in robotics arrives amid a flurry of announcements and activity at CES around humanoid robots. At the sprawling Las Vegas trade show, large and small companies demonstrated robots that could help build cars, clean toilets and deal games of poker - at a glacial pace.
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| Global semiconductor sales set a record in Nov. |
1/12/2026 |
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Global semiconductor revenue for November reached a record $75.3 billion, a 29.8% increase from a year ago, according to the Semiconductor Industry Association. Sales were up across major product categories and regions, except for Japan, where sales decreased 8.9%.
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| AI Triggers a New Memory Super Cycle |
1/9/2026 |
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As AI triggers a "butterfly effect" across the semiconductor supply chain, Macronix is deploying a comprehensive flash portfolio to navigate the next memory super cycle.
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| TSMC to Lead Rivals at 2-nm Node, Analysts Say |
1/8/2026 |
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Taiwan Semiconductor Manufacturing Co. is expected to maintain its lead in advanced semiconductor nodes with the launch of its 2-nanometer process, attracting major customers such as Nvidia, Advanced Micro Devices, Apple and Qualcomm, analysts say. While Samsung Electronics and Intel have faced challenges in advanced-node production,
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| SK hynix unveils 16-high 48Gb HBM4 |
1/8/2026 |
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SK Hynix has debuted a 16-high 48GB high-bandwidth memory at CES, a technical achievement due to the complexity of stacking 16 layers.
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| TSMC reportedly set to build 12 Arizona fabs as Japan, Germany expansions stall |
1/8/2026 |
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TSMC(2330.TW) has confirmed plans to expand its Arizona campus beyond the existing six fabs by adding two new fabs. Advanced packaging capacity will also increase from two fabs to three or four. This means TSMC is set to build up to 12 fabs in Arizona, keeping capital expenditures elevated through 2026-2028.
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