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Global Silicon Wafer Shipments Jump 13% YoY in Q1 2026 4/30/2026 Worldwide silicon wafer shipments increased by 13.1% YoY in the first quarter of 2026, according to the SEMI Silicon Manufacturers Group. SK hynix Verifies 12-Die Hybrid Bonded HBM Stack 4/30/2026 SK Hynix has verified a 12-die high-bandwidth memory stack using hybrid bonding, which enhances speed and efficiency by eliminating the need for bumps between memory layers. The company has reported yield improvements but has not disclosed specific figures. SK Hynix plans to continue using mass reflow-molded underfill technology until hybrid bonding is ready for mass production. JEDEC Previews LPDDR6 Roadmap Expanding LPDDR into Data Centers and Processing-in-Memory 4/30/2026 Building on the Mobile Legacy of LPDDR with Higher Capacity, Flexible Metadata and a Roadmap to LPDDR6 SOCAMM2 ROHM Launches Compact Wireless Power Chipset for Wearables 4/29/2026 ROHM's wireless power supply IC chipset is targeted at compact wearables such as smart rings and smart bands. Robotics stakeholders urge Congress to ‘act now’ to regain global leadership 4/29/2026 The United States will fall further behind China in deploying robotics with artificial intelligence without federal support, experts said at a subcommittee hearing Tuesday. Intel’s $13.6B in Q1 revenue driven by ‘tremendous’ AI demand 4/29/2026 The company’s x86 CPU franchise, advanced packaging technology and large manufacturing network position it well to compete in the nearly 1$ trillion semiconductor market, CEO Lip-Bu Tan said. SK Group Signs MOUs to Advance Vietnam’s AI Ecosystem and Infrastructure Development 4/28/2026 SK Group will collaborate with Vietnam to develop the country’s AI ecosystem and infrastructure. Rambus SOCAMM2 Server Module Chipset Enables Power-efficient AI Platforms 4/28/2026 Rambus's SOCAMM2 chipset is designed to enable low-power, high-performance LPDDR5X-based memory modules for AI server platforms. Smart Glasses Propel Growth of XR Market in 2025 4/28/2026 The rapid adoption of smart glasses fueled the 44.4% year-over-year growth of the global extended reality (XR) device shipments in 2025. TSMC Launches A13 Process and Advanced Technologies 4/28/2026 A13 maintains full backward compatibility with A14 design rules, enabling faster customer migration to the company’s nanosheet transistor architecture... Skydio pledges $3.5B to expand US drone manufacturing 4/27/2026 The funds will go toward establishing a fifth facility that will be “five times larger” than its other facilities in California, the Silicon Valley-based company said. Data center boom continues to buoy Texas Instruments 4/27/2026 On an earnings call, the company reported net income of $1.55 billion and gross profit of $2.8 billion. YouTuber Tackles the RAM Crisis by Making It Himself in a Home Clean Room 4/27/2026 This is not an affordable solution, but Dr. Semiconductor built a clean room in a backyard shed and used it to build his own RAM. Meta Informs Staff It Will Cut 8,000 Jobs Next Month 4/27/2026 Meta will also close 6,000 open positions. The company is taking these actions to offset its other investments, according to a leaked memo. Elon Musk Confirms Millions of Tesla Cars Need New Hardware For Full Self-Driving 4/24/2026 After years of selling vehicles that would one day run Full Self-Driving (FSD) features, Tesla has now confirmed that the hardware isn’t up to the task on millions of cars. TSMC plans to open chip packaging plant in Arizona by 2029 4/24/2026 TSMC said it ?was applying for permits to begin construction of its first advanced packaging ?plant in an existing Arizona facility, but did not give a ?timeline for when it will come online. Elon Musk says his TeraFab facilities will use Intel's 14A process technology to make AI chips 4/24/2026 SpaceX will be responsible for high-volume chip manufacturing in likely Intel tech licensing deal. JEDEC's LPDDR6 standard boosts AI workloads 4/24/2026 JEDEC has previewed its LPDDR6 memory standard, featuring SOCAMM2 modules and capacities up to 512 gigabytes. The standard aims to enhance performance and efficiency for AI data centers, PCs and mobile platforms, with memory makers already sampling LPDDR6 modules. Intel-Google Alliance Signals CPU Resurgence in AI Infrastructure Era 4/23/2026 Intel's CPU-centric tie-up with Google comes weeks after Arm launched a processor for agentic AI. Broadcom agrees to support development of Meta’s next-generation AI chips 4/23/2026 The “multiyear, multigenerational” deal builds on the companies’ existing AI chip partnership to support Meta Training and Inference Accelerator chips, Broadcom said. Apple Eyes Product Engineering Revival with CEO Transition 4/23/2026 The upcoming CEO, John Ternus, is known for engineering competence and spearheading in-house silicon into Apple products. OpenAI patent details AI chip with advanced HBM integration 4/23/2026 OpenAI has unveiled a patent for a custom AI chip featuring multiple compute chiplets and 20 high-bandwidth memory stacks, connected using embedded logic bridges similar to Intel's Embedded Multi-Die Interconnect Bridge. The design strives to overcome current packaging limitations by extending communication distances from 6 millimeters to 16 millimeters, potentially supporting larger AI models and high-performance computing. Foundry 2.0 Market Projected to Grow 17% in 2026 Amid AI Compute Boom 4/22/2026 The broadly defined Foundry 2.0 market is projected to surpass $360 billion in 2026, representing 17% YoY growth, according to IDC. Tim Cook to Step Down as Apple CEO, Hand the Reins Over to John Ternus 4/22/2026 Ternus, senior vice president of hardware engineering, will officially become Apple's new CEO in September. Cook will remain as the company's executive chairman. SK Hynix begins work on first US chip plant in Ind. 4/22/2026 SK Hynix has started building its first semiconductor facility in the US, located in Indiana, to expand advanced packaging for AI memory and enhance its global supply chain. The $3.87 billion project is set to begin mass production in 2028, focusing on high-bandwidth memory products. The plant's proximity to Purdue University is expected to foster collaboration.  1  |  2  |  3  |  4  |  5  |  6  |  7  |  8  |  9  |  10

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