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Broadcom flags supply constraints, says TSMC capacity a bottleneck 3/25/2026 Many ?customers are ?now entering long-term agreements with suppliers to secure capacity commitments for as long as three to four years, Lace raises $40M for helium atom beam lithography 3/25/2026 Microsoft-backed startup raises $40 million for advanced chipmaking equipment tech Microsoft Aims to Supercharge Windows Performance and Cut RAM Waste in 2026 3/25/2026 Perhaps this would help return some of the goodwill it lost in 2025. The FCC Just Banned the Sale of New Wi-Fi Router Models Made Outside US 3/25/2026 The surprising order means any new Wi-Fi router models sold in the country must be US-ma de, or receive an exemption from the Pentagon or Homeland Security Department. Why Data Center Chips Fail in Automotive Environments 3/24/2026 The AI vs auto chip war reveals how data center processors face reliability challenges in automotive environments, where vibration and thermal stress reshape IC design. AEM and ASE Ink Partnership to Accelerate AI and HPC Test Innovation 3/24/2026 AEM and ASE are collaborating to deliver disruptive test solutions tailored for the rapidly expanding AI and HPC markets. TI Advances Power Density in Data Centers, EVs with New Power Modules 3/24/2026 TI has unveiled new isolated power modules that help enable increased power density, efficiency and safety in applications ranging from data centers to EVs. Analog Devices Strengthens Presence in Asia with New Thailand Facility 3/24/2026 Analog Devices opened a new Thailand facility to expand resilient, sustainable semiconductor manufacturing and test capacity. Kioxia announces new Super High IOPS SSD that helps accelerate AI workloads on Nvidia GPUs 3/23/2026 25.6TB drive provides more GPU-accessible memory for faster data access Samsung Secures Exclusive HBM4 Supply Deal with OpenAI 3/23/2026 Samsung Electronics has secured a deal to exclusively supply sixth-generation high-bandwidth memory, known as HBM4, to OpenAI, according to reports. OpenAI intends to integrate the HBM4 into its AI semiconductor Titan, which is expected to be released later this year. Imec installs ASML's litho tool for sub-2nm chip development 3/23/2026 Imec has installed the ASML EXE:5200 high-numerical-aperture extreme ultraviolet lithography system, offering partners early access to advanced chip-scaling technologies. The tool, integrated with patterning and metrology tools, advances sub-2-nanometer logic and high-density memory, supporting AI and high-performance computing. Intel Positions Xeon 6 as CPU Engine for AI-ready Telco Infra 3/20/2026 Embedded Telecom operators are updating 5G infrastructure with AI and preparing for 6G. Nvidia CEO says ‘every industrial company will become a robotics company’ 3/20/2026 The technology giant is partnering with ABB Robotics, Fanuc, Yaskawa and more to accelerate robot deployment on production floors. ST partners with NVIDIA to boost global adoption of physical AI 3/20/2026 STMicroelectronics has announced new steps to accelerate the development and deployment of physical AI systems worldwide, including humanoid, industrial, service and healthcare robots. Kioxia's SSD achieves over 10M IOPS for AI workloads 3/20/2026 Kioxia has unveiled the E3.S CM9 series, a "super high" input/output operations per second solid-state drive designed to enhance AI workloads on Nvidia graphics processing units. The SSD, which offers 25.6 terabytes of capacity and can achieve more than 10 million IOPS, uses Kioxia's XL-Flash to reduce read latency, part of Nvidia's Storage-Next initiative. Manufacturers upbeat about outlook despite economic headwinds 3/19/2026 Although companies face trade uncertainties and other challenges, their overall sentiment has improved from the fourth quarter of 2025, according to a National Association of Manufacturers survey. Manufacturers upbeat about outlook despite economic headwinds 3/19/2026 Although companies face trade uncertainties and other challenges, their overall sentiment has improved from the fourth quarter of 2025, according to a National Association of Manufacturers survey. Tesla, LG to build $4.3B battery plant as part of supply agreement 3/19/2026 The Michigan manufacturing facility is scheduled to open in 2027 and will provide batteries for Tesla’s Megapack 3 utility-scale energy storage systems. Infineon executive urges Europe to build larger, automated fabs 3/19/2026 Thomas Altenmueller, Vice President Manufacturing Analytics at Infineon, said that ?Chinese manufacturers were rapidly gaining capacity and expertise in areas ?historically dominated by European chipmakers. AMD's Su to discuss foundry collaboration with Samsung 3/19/2026 Advanced Micro Devices CEO Lisa Su plans to visit Samsung Electronics' chip production site in Pyeongtaek, South Korea, to explore expanding cooperation beyond memory into foundry manufacturing, according to a source. Samsung has been supplying high-bandwidth memory 3E chips for AMD's AI accelerators since last year. AI Demand Drives 4Q 2025 Global Top 10 Foundries Revenue Up 2.6% QoQ 3/18/2026 The leading 10 foundries achieved around $169.5 billion in revenue in 2025, a 26.3% YoY increase that set a new industry record. Energy Department offers $500M to scale critical minerals production 3/18/2026 The U.S. Department of Energy said it will offer up to $500 million to expand the domestic production of critical minerals and materials for advanced batteries. This is its third related funding round since 2022. SK Group chairman: Memory shortage could last until 2030 3/18/2026 “AI actually wants to have a lot of HBM, and once you make the HBM…we have to use a lot of wafers,” said Chey, “So we need some time to build up more wafers, at least four to ?five years. Samsung's HBM4E memory offers 16 Gbps I/O 3/18/2026 Samsung has introduced its HBM4E memory, showcasing capabilities such as 16 Gbps I/O, 4 TB/s bandwidth per stack and 48 GB of memory per stack. The memory is designed for Nvidia's Rubin Ultra platform, which could benefit from up to 384 GB of HBM4E and 64 TB/s of bandwidth. SK Hynix boosts R&D amid high-bandwidth memory demand 3/17/2026 SK Hynix invested $4.4 billion in research and development in 2025, a 35% increase from 2024, driven by demand for high-bandwidth memory amid the global AI boom. The company also reported a record operating profit of $32 billion, surpassing Samsung Electronics for the first time.  1  |  2  |  3  |  4  |  5  |  6  |  7  |  8  |  9  |  10

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