|
 |
|
| NAND revenues forecast to be up 10% in Q2 |
6/3/2024 |
|
The surge in large enterprise SSD orders continues to drive up the ASP of NAND Flash by 15%. TrendForce forecasts Q2 NAND revenue to increase by nearly 10% QoQ.
|
|
|
| Malaysia seeks over $107B in chip investment |
5/29/2024 |
|
Malaysia is aiming to increase its role in the global semiconductor supply chain and is targeting more than $107 billion in investments in advanced packaging, manufacturing equipment and integrated circuit design, according to Prime Minister Anwar Ibrahim. Malaysia expects to contribute $5.3 billion to meet the targets.
|
|
|
| HBM Prices to Jump 5–10% in 2025 |
5/28/2024 |
|
HBM’s share of total DRAM bit capacity is estimated to rise from 2% in 2023 to 5% in 2024 and surpass 10% by 2025. In terms of market value, HBM is projected to account for more than 20% of the total DRAM market value starting in 2024, potentially exceeding 30% by 2025.
|
|
|
| Toshiba Completes 300mm Wafer Fab Facility for Power Chips |
5/28/2024 |
|
The completion of construction is a major milestone for Phase 1 of Toshiba’s multi-year investment program. Toshiba will now proceed with equipment installation, toward starting mass production in the second half of fiscal year 2024.
|
|
|
| TSMC Launches Program to Enhance Green Conservation |
5/28/2024 |
|
Moving forward on its commitment to protecting biodiversity, Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) has launched the “Eco Plus! – Ecological Harmony Program”, which integrates internal and external resources to connect fragmented biological habitats, enhance species survival, and establish a reward system to support potential talents and important ecological research on biodiversity.
|
|
|
| AMD aims to achieve 100x power efficiency boost by 2027 |
5/27/2024 |
|
Generative AI is driving the need for more performance using less energy, and AMD's strategy includes AI-specific architectures, tuning at the data center level and co-design efforts for hardware and software.
|
|
|
| Samsung refutes report of failing Nvidia's AI memory chip test |
5/27/2024 |
|
Samsung is currently testing its HBM chips with U.S. graphic chip giant Nvidia to supply the memory chips for Nvidia's AI processors, but Reuters reported that Samsung did not pass the test due to issues with heat and power consumption. Samsung Electronics refuted a Friday news report that it failed to pass a test of Nvidia's high-bandwidth memory (HBM) chips.
|
|
|
|
