Thursday, December 2, 2021

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NGK Insulators plans European plant switch to renewable energy 10/19/2021
NGK Ceramics Europe in Belgium will use completely green power, “procuring electricity generated through wind power as well as generating power by installing solar panels on its site”
New JEDEC Standard making it easier to change out flash memory soldered into connected devices applications 10/19/2021
The JEDEC Solid State Technology Association has released its first iteration of the Crossover Flash Memory (XFM) Embedded and Removable Memory Device (XFMD) standard. The spec outlines a new universal data storage media providing an interface between NVM Express (NVMe) and PCI Express (PCIe) in a small, thin form factor.
Component shortage slows smartphone market 10/19/2021
Global smartphone shipments fell by 6% in the third quarter of 2021 as vendors struggled to meet demand for devices amid component shortages, according to market analyst Canalys.
Israeli AI chip startup Hailo has raised $136 million in a Series C funding 10/18/2021
Hailo’s latest cash infusion will be used to continue building its software offering and support teams. The company has expanded its presence globally over the last year, opening offices in Tokyo, Taipei, Munich and Silicon Valley.
Samsung Foundry to offer GAA process by 2022 10/18/2021
amsung is being most aggressive pursuing the next generation of transistor technology, with plans to reach mass production ahead of TSMC and Intel. Samsung’s 3-nanometer process will use the gate-all-around (GAA) transistor structure, which the foundry calls MBCFET (Multi-bridge channel FET) and will be in production first half of 2022.
DRAM prices projected to be in downswing 10/18/2021
DRAM contract prices are likely to exit a bullish period that lasted three quarters and be on the downswing in the fourth quarter of 2021 at a quarter-on-quarter (QoQ) decline of 3-8%, according to TrendForce. This decline can be attributed to not only the declining procurement activities of DRAM buyers going forward, but also the drop in DRAM spot prices ahead of contract prices.
China and Taiwan combine now controls 37% of semiconductor global capacity 10/18/2021
As of December 2020, Taiwan held the largest share of IC industry capacity of any country or region in the world. Moreover, if combined, the share of IC capacity within the borders of China and Taiwan would represent about 37% of global IC capacity, about 3x the amount of IC capacity located in North America.
AMD offers new $329* Radeon RX 6600 graphics card 10/15/2021
The graphics card that should be available at Amazon, Best Buy, Micro Center and the Newegg Shuffle starting as soon as the very moment we published this story at 9AM ET. Given how exorbitant GPU prices have been during the global chip crunch, you should probably stop reading if you want one and get with the clicking.
Electronic waste to weigh 57 million tonnes this year 10/15/2021
According to a 2019 report by the World Economic Forum, the world's electronic waste has a material value of $62.5 billion (£46 billion) - more than the GDP of most countries.
After all, Taiwan still leads Korea in advanced note processing 10/15/2021
Taiwan by far holds the largest share of leading-edge (i.e., <10nm) IC capacity (63%) of any country in the world. South Korea, represented by Samsung, holds the remaining 37%.
Demand for automotive electronics to drive volume up for power wafers 10/15/2021
Installed capacity for the power and compound fab industry grew 5% in 2019 and 3% in 2020 before surging 7% in 2021, SEMI said. Growth is projected to remain strong at 6% in 2022 and 5% in 2023 as the industry tops the 10 million WPM mark.
Yangtze Memory Technologies license Xperi’s DBI hybrid bonding technology to package NAND devices 10/14/2021
“Xperi’s DBI hybrid bonding is a key enabling technology for current and future generations of high performance, high-capacity 3D NAND flash memory,” said Craig Mitchell, president of Invensas, a wholly owned subsidiary of Xperi.
Samsung mass producing 14nm DDR5 DRAM using 5 layer EUV technology 10/14/2021
Following the company’s shipment of its first EUV DRAM in March of last year, Samsung has increased the number of EUV layers to five to deliver today’s DDR5 devices.
MediaTek posted record highs 10/14/2021
MediaTek recorded NT$47.91 billion (US$1.7 billion) for its September sales, which represents an 11.9% increase from August figures, and a 26.51% year-on-year change. Third-quarter 2021 revenue came in at NT$131.07 billion, a 4.31% bump compared to Q2 results.
Senator Elizabeth Warren called for breaking up Amazon.com 10/14/2021
Investigation showed the e-commerce giant had copied products and rigged search results in India. Meanwhile, a bipartisan group of U.S. lawmakers plans to introduce a bill that would bar Big Tech platforms from favoring their products and services.
Semiconductor merger and acquisition to reach $22 Billion this year 10/13/2021
Pace of semiconductor acquisition agreements fell back over the next five months of 2021, putting this year’s total M&A value at $22 billion for the January-August period, according to IC Insights’ September Update of the 2021 McClean Report.
Foxconn to work with Lordstown Motors on developing light duty EV fleet trucks 10/13/2021
they have reached an agreement in principle to work jointly on Lordstown Motors’ electric vehicle programs in Lordstown Motors’ 6.2 million square foot production and assembly plant in Lordstown, Ohio.
Samsung Foundry to offer 3nm and 2nm based Gate-All-Around (GAA) process 10/13/2021
At this year’s event, Samsung shared its vision to bolster its leadership in the rapidly evolving foundry market by taking each respective part of foundry business to the next level: process technology, manufacturing operations, and foundry services.
Rain Neuromorphic taped out its analog AI chip 10/13/2021
Rain Neuromorphics has taped out a demonstration chip for its brain-inspired analog architecture that employs a 3D array of randomly-connected memristors to compute neural network training and inference at extremely low power.
Intel certifies Kingston DDR5 modules for Alder Lake CPU 10/12/2021
Kingston is ready for the new era, with at least two kits that it claims are the very first to pass muster from the Intel Platform Validation program.
TSMC and Sony Group are considering joint construction of a semiconductor factory in western Japan 10/12/2021
The total investment in the project is estimated at 800 billion yen ($7 billion), with the Japanese government expected to provide up to half the amount.
End of AMD Play Station 5 shortage may finally be in sight 10/12/2021
Lisa Su, the CEO of AMD, said this week (via Spieltimes): “I expect it to be from June-September of next year 2022 when, perhaps, it will be possible to go down to a video game store or a department store to buy a PlayStation 5 or an Xbox Series X without it being an impossible task.”
Intel is contesting the uncontested Nvidia 10/12/2021
Intel is contesting the uncontested Nvidia on graphics and networking.
Gaming PCs expected continue to be strong through 2025 10/11/2021
For gaming PCs, which includes both desktop and notebook PCs, unit shipments are expected to grow from 41.3 million in 2020 and to 52.3 million in 2025. Similarly, the gaming monitor market is expected to jump from 14.2 million units shipped to 26.4 million during the same time frame. This equates to the two product categories having five-year compound annual growth rates (CAGRs) of 4.8% and 13.2%, respectively.
Siemens Digital 's mPower software delivers power integrity analysis for all versions of 2D designs 10/11/2021
Using mPower, IC designers can more quickly and thoroughly verify that their designs meet power-related design goals—capabilities that can help IC customers dramatically boost quality, enhance reliability and speed time to market.
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