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| Apple chooses TSMC's packaging for A20 chip |
5/1/2026 |
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Apple will reportedly not use WMCM packaging for its A20 chip in the base iPhone 18 due to DRAM shortages and cost concerns, opting instead for Taiwan Semiconductor Manufacturing Co.'s Integrated Fan-Out packaging. However, Apple plans to use WMCM for the A20 Pro in the iPhone 18 Pro and Pro Max.
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| Samsung Q1 chip profit hits $36bn on sales of $94bn |
5/1/2026 |
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Samsung Electronics has reported a first-quarter semiconductor profit of $36 billion, up 49 times year over year, on $94 billion in revenue, driven by high-bandwidth memory demand and data center expansion. The company has initiated mass production of HBM4 and SOCAMM2 for Nvidia's Vera Rubin platform and developed PCIe Gen6 solid-state drive
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| AI memory needs to surge 1,000x |
5/1/2026 |
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Professor Kim Jung-ho of the Korea Advanced Institute of Science and Technology projects a 1,000-fold increase in memory capacity requirements driven by AI inference over the next 30 years.
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| SK hynix Verifies 12-Die Hybrid Bonded HBM Stack |
4/30/2026 |
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SK Hynix has verified a 12-die high-bandwidth memory stack using hybrid bonding, which enhances speed and efficiency by eliminating the need for bumps between memory layers. The company has reported yield improvements but has not disclosed specific figures. SK Hynix plans to continue using mass reflow-molded underfill technology until hybrid bonding is ready for mass production.
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| JEDEC's LPDDR6 standard boosts AI workloads |
4/24/2026 |
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JEDEC has previewed its LPDDR6 memory standard, featuring SOCAMM2 modules and capacities up to 512 gigabytes. The standard aims to enhance performance and efficiency for AI data centers, PCs and mobile platforms, with memory makers already sampling LPDDR6 modules.
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