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| TSMC to invest $100B in US manufacturing |
3/4/2025 |
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The chipmaker plans to build two additional semiconductor facilities in Arizona, creating thousands of jobs. The company is in the midst of constructing three chip factories in the state.
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| Samsung faces 10-month deadline for 2nm yielding |
3/4/2025 |
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With Intel drawing a veil over the yields on its equivalent 18A process, it remains a moot point whether, in 2026, the industry will only have one company capable of manufacturing at the leading edge
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| Next-gen Snapdragon X2 chips for PCs to boost core count from 12 to 18 |
3/4/2025 |
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Qualcomm's next-generation Snapdragon X2 processor for Windows PCs could feature up to 18 Oryon V3 cores, a 50% increase over the current generation, according to reports. The system-in-package design might include 48GB of RAM and a 1TB solid-state drive, potentially using the Snapdragon X2 Ultra Premium brand.
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| OpenAI delays GPT-4.5 rollout amid GPU shortage |
3/3/2025 |
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Graphics processing unit shortages have delayed the full rollout of OpenAI's GPT-4.5, CEO Sam Altman said. The model is available only to Pro subscribers, but OpenAI plans to add tens of thousands of GPUs soon, expanding access to Plus subscribers. The shortage highlights the growing demand for computing power as AI models become more advanced.
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| Micron rolls out DDR5-9200 using EUV technology |
2/27/2025 |
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Micron has launched 16Gb DDR5-9200 memory chips using the 1-gamma process with extreme ultraviolet lithography. The chips offer a 30% higher bit density and 20% less power consumption when compared to previous versions.
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| Intel leads as first adopter of ASML's high-NA EUV tech |
2/27/2025 |
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Intel is using a pair of ASML High-NA Twinscan EXE:5000 extreme ultraviolet lithography tools at its D1 development fab in Oregon, processing 30,000 wafers for research and development. Intel plans to use the tools to produce 1.4-nanometer chips, with its sights on setting industry standards and gaining an edge.
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