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| JEDEC's LPDDR6 standard boosts AI workloads |
4/24/2026 |
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JEDEC has previewed its LPDDR6 memory standard, featuring SOCAMM2 modules and capacities up to 512 gigabytes. The standard aims to enhance performance and efficiency for AI data centers, PCs and mobile platforms, with memory makers already sampling LPDDR6 modules.
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| OpenAI patent details AI chip with advanced HBM integration |
4/23/2026 |
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OpenAI has unveiled a patent for a custom AI chip featuring multiple compute chiplets and 20 high-bandwidth memory stacks, connected using embedded logic bridges similar to Intel's Embedded Multi-Die Interconnect Bridge. The design strives to overcome current packaging limitations by extending communication distances from 6 millimeters to 16 millimeters, potentially supporting larger AI models and high-performance computing.
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| SK Hynix begins work on first US chip plant in Ind. |
4/22/2026 |
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SK Hynix has started building its first semiconductor facility in the US, located in Indiana, to expand advanced packaging for AI memory and enhance its global supply chain. The $3.87 billion project is set to begin mass production in 2028, focusing on high-bandwidth memory products. The plant's proximity to Purdue University is expected to foster collaboration.
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| Silicon Motion unveils SM8008 PCIe Gen5 controller for enterprise boot SSDs |
4/21/2026 |
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Silicon Motion has introduced a PCIe Gen5 x4 NVMe controller for enterprise boot solid-state drives, targeting power-sensitive storage in data centers. Built on Taiwan Semiconductor Manufacturing Co.'s 6-nanometer process, it offers up to 14 GB/s throughput and 2.3 million input-output operations per second, while consuming less than 5 watts.
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| Foundry 2.0 Market Projected to Grow 17% in 2026 Amid AI Compute Boom |
4/20/2026 |
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The broadly defined Foundry 2.0 market, comprising pure-play foundry, non-memory IDM, outsourced semiconductor assembly and test (OSAT), and photomask fabrication, is projected to surpass $360 billion in 2026, representing 17% year-over-year growth, according to International Data Corp.’s (IDC) latest Global Semiconductor Supply Chain Tracking Intelligence,
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| New lithography roadmap reveals that TSMC will initially set a target of 5,000 wafers for its sub-1nm process |
4/20/2026 |
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With Apple introducing its A20 and A20 Pro range for its iPhone 18 family, but there’s little time for taking breaks, especially in the silicon industry, because the question is, what comes after this manufacturing process? According to the latest report, the trillion-dollar entity’s exclusive semiconductor partner, TSMC, is planning to achieve a new milestone by introducing its sub-1nm technology in a few years, with trial production expected in 2029.
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| Ex-Qualcomm, Apple engineers launch AI-focused CPU startup |
4/20/2026 |
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Former Qualcomm, Apple and Nuvia engineers have launched Nuvacore, a startup developing a general-purpose CPU core optimized for data center AI workloads. The company, backed by Sequoia Capital, aims to "rewrite the rules of silicon" by maximizing area efficiency and performance.
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| TSMC's Q1 profit rose 58% on demand for advanced nodes |
4/17/2026 |
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Taiwan Semiconductor Manufacturing Co. reported a 58% year-over-year increase in first-quarter profit, reaching $18.2 billion on revenue of $35.9 billion, which rose 40.6%. Strong demand for 3-nanometer and 5nm technologies drove these results, with advanced technologies making up 74% of wafer revenue.
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| YMTC to build 2 more fabs, boost domestic tooling |
4/16/2026 |
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Yangtze Memory Technologies is reportedly planning to build two more fabs in Wuhan, China, using domestic chipmaking tools to more than double wafer output. The Phase 3 fab, set to begin operations this year, has sourced more than 50% of its equipment from Chinese suppliers, marking a shift since YMTC was added to the US Entity List in 2022. The factories would each produce 100,000 wafers monthly, reports say.
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| Meta, Broadcom sign AI chip deal |
4/16/2026 |
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Meta and Broadcom have announced a partnership to co-develop custom AI silicon, known as XPUs, to meet Meta's massive AI demands. Broadcom CEO Hock Tan also plans to leave Meta's board after two years.
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