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| Singapore made offer to buy ChipPAC |
3/1/2007 |
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Temasek subsidiary Singapore Technology Semiconductors said Thursday it would pay $1.14 per share for the 64.4 percent of STATS ChipPAC that it doesn't already own, rising to $1.23 per share if its final stake exceeds 90 percent.
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| Vista expected to create memory market 2H |
2/28/2007 |
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Powerchip Semiconductor Corporation (PSC) president Brian Hsieh today expressed optimism that the Windows Vista operating system will drive up DRAM prices in the second half of the year.
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| Qimonda to consolidate distribution in Singapore |
2/28/2007 |
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Qimonda's customers in the US, Europe and Asia Pacific will soon be receiving their orders of dynamic random access memory, or DRAM, chips from the spanking new 25,000 square feet storage and distribution facility in Singapore.
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| China RoHS: Effective March 1, 2007 |
2/28/2007 |
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Specifically, China is requiring all products that meet its regulations for the six hazardous substances include a logo to signify that, an “e” enclosed by a green circle. If the product does not meet the regulations, China requires that a listing of the included hazardous substances be include in the product’s documentation and a different circle logo be included on the packaging.
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| Sematach on shaky ground ? |
2/28/2007 |
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Freescale is exiting the chip-making organization. Meanwhile, Micron (Boise, Idaho) has joined the International Sematech Manufacturing Initiative (ISMI), bringing its overall membership to 14 companies.
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| AMD to try fusion chips with both SOI and standard CMOS approach |
2/27/2007 |
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AMD is designing two versions of its Fusion processors. One version is said to be manufactured by AMD itself using silicon-on-insulator process technology, whereas the other one may be made by former-ATI’s (now AMD’s graphics product group) main foundry partner,
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| Samsung to ship phase RAM sample |
2/27/2007 |
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The company said it has offered 256 to 512 Mb, 90-nm node product to several major mobile pone manufacturers. Toward the volume production slated for the first half of 2008,
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| Intel to upgrade N.M. fab to 45nm |
2/27/2007 |
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Fab 11X will be the company's fourth factory scheduled to use the 45nm process, with production in New Mexico scheduled to start in the second half of next year.
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| Intel fights for $2.4B export sales tax |
2/27/2007 |
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The company said if it loses the appeal there is a "possibility of a material adverse impact on the results of operations" for the period when the matter is resolved.
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| Cypress backs out of fab. business |
2/26/2007 |
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Already a partner of Grace Semiconductor Manufacturing Corp., Cypress is turning to UMC to help solidify its "fab lite" strategy, something Cypress pithily labels "No More Moore." It's also an important move to shore up outsourced capacity at the leading edge.
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| Infinera to raise fund through IPO |
2/26/2007 |
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Infinera Inc., the start-up that used a proprietary InP processes to integrate photonic and electronic elements in photonic ICs and which has raised over $330 million in venture capital funding since its founding in 2000, is to raise $150 million through an IPO.
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| IBM chooses immersion against EUV |
2/26/2007 |
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IBM Corp. Friday (Feb. 23) outlined its lithography roadmap, saying that it would extend 193-nm immersion lithography down to the 22-nm node for logic production. In other words, extreme ultraviolet (EUV) lithography could get pushed out again.
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| Microsoft's $1.52B patent verdict prompts cry for reform |
2/26/2007 |
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Computer and software makers have argued that the patent system gives too much power to patent holders, many of whom don't sell any products but seek to make money by suing profitable companies and holding them to ransom.
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| AMD offers energy-efficient chips |
2/22/2007 |
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AMD introduced two single-core desktop chips that use less power than previous models, and a dual-core processor for high-quality graphics and video on Microsoft's Windows Vista.
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| Smart offers Liquid Cooled DIMM Memory |
2/22/2007 |
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SMART Modular Technologies has launched a family of liquid-cooled DDR2 registered DIMMs (RDIMMs) that are designed to remove heat more effectively than conventional air-cooled RDIMMs that use fans or heat sinks.
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| SanDisk to cut jobs |
2/21/2007 |
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SanDisk implemented a series of cost-cutting moves, including cutting its global workforce by about 10 percent and reducing salaries for all executives.
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| HP profit up 26% on PC sales |
2/21/2007 |
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HP reported a 26% increase in first-quarter net profit, powered by stronger sales of personal computers and imaging and printing devices.
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| Hitachi unveil low power memory chip |
2/20/2007 |
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Renesas Technology and Hitachi have jointly developed a non-volatile memory module for integration on microcontrollers used in embedded systems.
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