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China,Sony&Ericsson sets up China Manufacturing Base 6/26/2007
The construction of a new factory in Beijing has been started ,which is a move of Sony Ericsson deemed to make China its global manufacturing base.
Hard-Disk Makers Develop New Storage Technique 6/26/2007
A new technique is being researched to expand the life of perpendicular recording in hard disk drives. It is said that the disk track media might be able to nearly double the density of bits on a disk.However, this approach is still controversial.
Google Threatens to Shut Down Gmail in Germany 6/26/2007
Google Inc.might end the German version of its Gmail service if a proposed German surveillance law goes into effect .
Zarlink acquires Legerity 6/26/2007
Zarlink Semiconductor Inc. announced that he has signed an aggrement to acquire Legerity Holdings Inc. for $134.5 million in cash.
Nintendo Overtakes Sony in Game Industry 6/25/2007
On June 25,Nintendo briefly surpassesd Sony who has dominanted the game industry for decades in market capitalization.
Kingston unveils DDR3 memory 6/25/2007
Kingston's HyperX 1375MHz and ValueRAM 1066MHz DDR3 SDRAM modules comes to the market. DDR3 with a lower overall power consumption will not show a brilliant performance.
TI accused of Water Contamination 6/25/2007
TI is under an accusation of contamination of groundwater by more than one hundred residents living in a community west of Texas Instruments Inc.'s headquarters.
Elpida hangs up price war 6/25/2007
Elpida Memory Inc. hangs the price war that hurt sales early in the year with a preview of a big sale in the second half of the year.
Infineon close R & D center in Sweden 6/22/2007
Infineon Technologies AG is closing an R&D operation at Kista, Sweden, affecting 130 jobs.
Powerchip to invest in DRAM chip test plant 6/22/2007
Powerchip Semiconductor Corporation on June 21 held a ground breaking ceremony for its IC research and testing center in Hsinchu, Taiwan
AMD to launch Phenom CPU in November 6/22/2007
AMD's family of high-end desktop CPUs Phenom is scheduled to start appearing in November.
Toshiba introduces NAND flash that supports both SLC and MLC architectures 6/21/2007
Toshiba announced a new series of mobile phone embedded NAND flash memories, mobileLBA-NAND, in a configurable single-level cell (SLC) memory area and a multi-level cell (MLC) memory area.
Intel to speed up introduction of Bearlake Chipsets 6/21/2007
Intel plans to suspend production of five 1066MHz Core 2 Duo CPUs by late 2007 and boost Intel 3-series desktop chipset (Bearlake) sales.
Foxconn may acquire taiwanese memory module company 6/21/2007
Foxconn Electronics is attempting to extend its presence in DRAM module business is being fueled by reports that the company has recently accumulated shares at Transcend Information.
Toshiba speed up Flash Memory production 6/20/2007
Toshiba plans to speed up its flash memory expansion plans and boost production capacity by 70 percent by June 2008.
TSMC to purchase Fab Equipments from Hynix 6/20/2007
Taiwan Semiconductor Manufacturing Co Ltd may decide sometime in September whether to purchase equipment from Hynix Semiconductor.
Samsung launch 1 Terabyte Hard-Disk 6/20/2007
Samsung has announced its one terabyte (TB) F1 series hard disk drive (HDD), which features the highest recording density in a 3.5-inch HDD using only three disks
Russia to build 300mm Fab 6/19/2007
Russia is planning to construct a 300-mm wafer fab at Nizhny Novgorod according to Alexander Kalinin, deputy chairman for the Russian Federal Fund for Electronics.
Yahoo replace CEO 6/19/2007
Yahoo replaced Chief Executive Terry Semel with its co-founder Jerry Yang, bowing to pressure as the company has fallen behind Google.
Google opens China R & D center 6/19/2007
Google plans to open a research and development center in Shanghai, stepping up its effort to build a bigger search business in China.
Taiwan company reluctant to setup Korean Memory Testing Plant 6/18/2007
Taiwan's memory back-end service providers are showing little interest in Hynix Semiconductor's offer of incentives aimed at luring them to set up a testing plant in Korea.
Dram price to rebound by late June 6/18/2007
DRAM module makers in Taiwan generally believe DRAM prices should hit bottom during late June with a rebound to follow soon.
Kingston China starts test operation 6/18/2007
Kingston Technology's fully-owned testing and packaging house Payton Technology has started production at its window ball grid array (WBGA) lines
Hynix credit rating improved 6/15/2007
'Hynix will maintain its strong position in the global dynamic random access memory (DRAM). In addition, it will remain competitive due to its continual migration into 66nm processing technology and the fact that its planned 12-inch wafer production capacity in China and Korea'
Flash cache on PC not found very powerful 6/15/2007
The technology may have a hard time finding a foothold on the desktop—at least, motherboard manufacturers seem to think so. They believe the performance gains offered by Turbo Memory are not significant,
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