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WiMax 700MHz getting to heat up |
8/13/2007 |
For its part, Intel began sampling last week prototypes of its Echo Peak chip set, a module that supports both 802.11n and WiMax. The module will be part of Intel's Montevina notebook platform that ships in late 2008.
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Vietnam, the next manufacturing frontier? |
8/13/2007 |
Rick Howarth, general manager of Intel Products Vietnam, told press that construction on the company's 500,000-square-foot facility in the Saigon Hi-Tech Park would begin in December, and was targeted for completion by mid-2009.
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Nextest quarterly revenue down substantially |
8/10/2007 |
NAND flash ATE maker Nextest Systems Corp. said revenue for the quarter ended June 30, was $13.78 million, down 35 percent from the March 2007 quarter revenue of $21.2 million and down 47 percent from the June 2006 quarter revenue of $26.1 billion.
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AMD to restructure debt, tap extra fund |
8/10/2007 |
AMD said today it will restructure some of its roughly $5 billion debt, floating $1.5 billion in convertible notes to repay a loan it had with Morgan Stanley.
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Output for 300mm fab to double by 2008 |
8/9/2007 |
Worldwide 300-mm capacity will double from the beginning of 2007 to the end of 2008, as 25 new 300-mm high-volume fabs come online, according to SEMI. By the end of 2008, some 73 300-mm fabs will provide over 6.2 million wafers per month.
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Hynix, Sandisk co-develop new fab |
8/9/2007 |
SanDisk and Hynix plan to build a joint fab for NAND flash, according to a report quote an article from Wall Street Journal as source.
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Cisco earnings beat estimates |
8/8/2007 |
Cisco Systems Inc. posted a higher-than-expected 25 percent rise in quarterly profit and raised its long-term revenue target as more companies bought equipment to handle Web traffic.
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STMicro to build Nokia 3G chip |
8/8/2007 |
Nokia, the world's top cellphone maker, said it would outsource the last of its chip business to STMicroelectronics to free up resources for other areas, lifting shares in both companies.
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DDR3 sets to overtake DDR2 by 2009 |
8/7/2007 |
Memory vendors have started sampling DDR3 SDRAM chips this summer, but significant volume production aren't expected until mid-2009.
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Microsoft cut Xbox price |
8/7/2007 |
Microsoft cut price for its Xbox 360 video game consoles by up to $50 in an effort to keep pace with similar moves by rival Sony.
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Xilinx CEO to retire |
8/7/2007 |
Xilinx Inc. said that its current president and CEO Willem Roelandts intends to retire.
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Chips sales in 1st half 2007 up modestly |
8/6/2007 |
Semiconductor sales showed modest growth year-over-year during the first six months of 2007, according to a report issued by the Semiconductor Industry Association (SIA).
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Nokia, Microsoft to sign licensing deal |
8/6/2007 |
Nokia will start to use Microsoft's copy protection software to boost the use of wireless entertainment, like music and videos, the two companies said on Monday.
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UTAC reports poor 2Q revenue |
8/3/2007 |
Free-falling DRAM prices affected United Test and Assembly Center 's performance in the second quarter.
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Hynix runs into 60nm production issues |
8/3/2007 |
Apple has turned to Samsung to fill NAND flash orders as Hynix has run into problems with its 60nm multi-level cell (MLC) process, according to memory module makers.
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