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Blue Solutions and Foxconn to Collaborate on Solid-state Battery Ecosystem 11/3/2023
Blue Solutions and Foxconn will jointly develop a solid-state battery ecosystem for the electric two-wheeler market.
YMTC offers 3D QLC NAND memory touts 232 layers, highest density 11/2/2023
The new 3D NAND memory devices boast the industry's highest recording density of as well as extreme performance due to Xtacking 3.0 architecture.
Samsung plans to up NAND prices, lower production 11/2/2023
Samsung Electronics Co. has formed a strategy to increase NAND prices by 20 percent each quarter until the second quarter of 2024. The move is the company’s bid to reverse the market in the first half of next year by stabilizing NAND prices.
AMD touts MI300 series, expects $2B from AI chips in 2024 11/2/2023
Advanced Micro Devices expects to launch its MI300 series of AI chips soon and reports surging demand for graphics processing units that can train generative AI models. AMD says data center GPU revenue in the fourth quarter will likely hit $400 million and could top $2 billion in 2024.
Modi Wants India to Take Global Leadership in 6G 11/2/2023
At IMC 2023, PM Narendra Modi raised the clarion call for India to take a leadership role globally in 6G.
Intel divests its silicon photonics line to Jabil 11/1/2023
Intel has signed an agreement with Jabil to divest its silicon photonics module line, Intel's third divestiture in recent months. Jabil executive Matt Crowley sees the move as a way for Jabil to increase its support in the data center ecosystem.
Vietnam in early talks to build country's first fab 11/1/2023
The Southeast Asian electronics manufacturing hub already hosts U.S. giant Intel's (INTC.O) largest semiconductor packaging and testing plant worldwide and is home to several chip designing software firms. It is working on a strategy to attract more semiconductor investment, including from foundries, which focus on manufacturing chips.
Samsung to focus on AI chips in 2024 amid recovery 11/1/2023
Samsung Electronics is planning to boost its production of high-bandwidth memory next year as demand for AI chips continues. The company's operating loss narrowed in the third quarter, and sources say Samsung has secured an order for Google's Tensor G4 chipset for next year's Pixel 9 smartphone.
UMC Launches Wafer-to-Wafer 3D IC Project 11/1/2023
UMC has initiated the W2W (wafer-to-wafer) 3D IC project to help customers accelerate production of their 3D products.
Nvidia: Feds immediately halting AI chip exports to China 10/31/2023
The restrictions were supposed to be introduced 30 days from 17 October. That was when President Joe Biden's administration announced measures to block countries, including China, Iran and Russia, from buying high-end AI chips designed by Nvidia and others.
SK Hynix books 2024 capacity of HBM3/3E 10/31/2023
SK Hynix says it has fully booked its HBM3 and HBM3E capacity for next year with customers asking for more. High bandwidth memory is forecast to increase 60% to 80% each year over the next five years.
Power Integrations Launches 1.25kV GaN Switcher IC 10/31/2023
It is said to be the world’s highest-voltage, single-switch gallium-nitride (GaN) power supply IC, featuring a 1.25kV PowiGaN switch.
Mouser Electronics Inks Distribution Agreement with Siemens for Industrial Automation Solutions 10/31/2023
Mouser Electronics Inc. is partnering with Siemens on its distribution of industrial automation solutions. Siemens’ operations encompass factory automation and digitalization in the process and manufacturing industries, intelligent infrastructure for buildings and distributed energy systems, rail transport solutions, as well as health technology and digital healthcare services.
Huawei's Mate 60 Pro with 5G lifts its market share 10/30/2023
Huawei Technologies has seen success in China with its Mate 60 Pro smartphone with 5G connectivity and advanced chip technology, with sales up 37% year over year, Counterpoint Research reports. Its market share rose to 12.9% from 9.1% last year, while Apple, Oppo and Vivo saw declines in the double digits.
Western Digital, Kioxia halt merger talks 10/30/2023
Sources say Western Digital and Kioxia have ended negotiations over a planned merger amid opposition from SK Hynix, an investor in Kioxia. The companies were also in disagreement about the semiconductor memory business merger conditions set by Kioxia shareholder Bain Capital.
HPC, AI, and HBM Driving the Future of Medical Research 10/30/2023
High-performance computing (HPC), designed for computationally intensive workloads, is helping life sciences and medical researchers get answers faster and more cost-efficiently. When combined with accelerated computing, AI, high-bandwidth memory (HBM) and other advanced memory architectures.
TrendForce predicts Global Notebook Market to Rebound in 2024 10/30/2023
According to TrendForce. Both North America and Asia-Pacific regions are demonstrating a healthy appetite for mid and low-tier consumer models.
Dresden, Germany official hails TSMC's plans for its first fab in Europe 10/27/2023
Mayor Dirk Hilbert told CNA the semiconductor project was the largest single investment in the state of Saxony and in its capital, Dresden. He hoped that many local businesses could become suppliers to TSMC.
SK Hynix prioritizes DDR5, HDM chips 10/27/2023
SK Hynix is planning to increase investments in DDR5 and high bandwidth memory chips amid growing demand for AI. The chipmaker also announced its opposition to the proposed Kioxia-Western Digital merger.
Expedera Expands Global Presence with New R&D Office in Singapore 10/27/2023
“The new subsidiary will develop complementary technologies and services that improve customer experience. We aim to position Expedera as the solution provider of choice for system architects and chip designers who demand the highest-performing, lowest-power edge inference engine.”
Renesas Launches Induction Motor Position Sensing Technology 10/27/2023
Renesas Electronics Corp. has developed an inductive position sensor (IPS) technology for highly accurate motor position sensor ICs for robotics, industrial and medical applications. Utilizing non-contact coil sensors, the position sensing technology can replace expensive magnetic and optical encoders now commonly used in motor control systems
ON Semiconductor finishes fab plant for SiC wafers in South Korea 10/26/2023
The new facility, named S5 Line, is a fab plant that produces silicon carbide (SiC) wafers, with a capacity of more than 1 million 200mm SiC wafers per year when fully operational.
Micron embedded products power Qualcomm's XR platform 10/26/2023
Micron Technology asserts that its low-power double data rate 5X DRAM and Universal Flash Storage 3.1 bring speed and performance to Qualcomm Technologies' extended-reality platform. The Snapdragon XR2 Gen 2 processor offers untethered mixed reality and virtual reality, and the LPDDR5X boosts power efficiency 24% over previous generations, Micron says.
Intel to expand technology, add employees in Hillsboro, Ore 10/26/2023
.ntel is expanding its semiconductor technology development at its innovation hub in Hillsboro, Ore., with investment that will include a high-tech lithography machine to create more powerful and efficient chips. Intel vice president Ann Kelleher said the company intends to add thousands of jobs at the site, which is the company's largest and already employs more than 25,000.
Feds immediately halting AI chip exports to China 10/26/2023
Nvidia says it has been told by the US government to immediately halt exports of advanced AI chips to China, changing a timeline that originally called for a 30-day window after Oct. 17. The chips in question were specifically designed for the Chinese market to fit parameters outlined by earlier restrictions imposed by the government.
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