LPDDR memory has been almost synonymous with mobile devices, but starting with the new LPDDR6 specification released in July 2025 by JEDEC, it will begin showing up inside of data centers, as well, early next year. The key factors in various flavors of DRAM are bandwidth, capacity, and cost. HBM is the fastest, but it’s also expensive, and it requires a 2.5D or 3.5D packaging approach. GDDR is good for inferencing due to its 36 Gbit/sec performance, but it has limited capacity. And LPDDR6 has lots of capacity and a low-power footprint, but not at the same data throughput GDDR or HBM. Frank Ferro, group director for product management at Cadence, talks with Semiconductor Engineering about what memory works best where and why, the new security features in LPDDR6 that are essential for data centers, as well as the challenges of working with so many pins and PHYs.

By: DocMemory
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