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Samdung to spend $230B for a fab cluster in South Korea 3/16/2023 "We will grow the ‘semiconductor mega cluster’ to the world’s largest in connection with the existing memory semiconductor manufacturing complexes.” New cybersecurity standards are coming for connected IoT devices 3/16/2023 The national cybersecurity label NIST is developing for consumer Internet of Things (IoT) products and consumer software products. Qorvo offers Single Chip Battery Management System 3/16/2023 The two PACs are the industry’s first single-chip solutions to offer support for battery packs with up to 20 cells in series (20s). Foxconn plans to build a factory in India to produce AirPods for Apple 3/16/2023 Apple supplier to further diversify production away from China. AirPods are currently made by a range of Chinese suppliers. IST banks funds $8.5M in resistive RAM technology startup 3/15/2023 Memory startup Intrinsic Semiconductor Technologies has scored funding aimed at bringing its Resistive RAM to market, which it grandly states will enable a new generation of smart devices and systems with embedded intelligence. Renesas shows First AI Implementations on Arm Cortex-M85 3/15/2023 Renesas is doing live demonstrations of AI and ML implementations on an MCU based on the Arm Cortex-M85 processor at embedded world 2023. Microchip Expands Secure Authentication Chip Portfolio 3/15/2023 Microchip has expanded its secure authentication device portfolio with six new products in its CryptoAuthentication and CryptoAutomotive IC families. Iin-circuit testing process must adapt and keep up with the growing demand for low-cost electronics products 3/15/2023 The use of highly-panelized boards has become a common technique in the manufacturing process to improve the throughput and increase production volumes. Samsung Electronics is recruiting workers from its rivals such as TSMC, Apple and Qualcomm 3/14/2023 Samsung recently recruited former TSMC engineer Lin Jing-Cheng as its executive vice president. Spending 19 years at TSMC, the global leader in the semiconductor foundry business, Lin is a specialist in the chip packaging business. ASML suppliers may build Asia plants outside China 3/14/2023 Officials from a dozen tech companies are set to visit Vietnam, Malaysia and Singapore next week, according to a note from the Brabant Development Agency, a Dutch public body involved in organising the trip. TSMC find it challenge to transfer part of its huge AR construction costs to customers 3/14/2023 The overall construction and equipment installation progress at TSMC's new wafer fab in the southwestern state of Arizona reportedly have been delayed, while the foundry also has to tackle serious manpower shortages, soaring costs and emerging education and adaptation issues involving Taiwanese and foreign employees. U.S. might add more restrictions on the export of semiconductor manufacturing gear to China 3/14/2023 Escalating rules aimed at preventing the country from developing an advanced chip industry. Galaxy S24 chipset to challenge the iPhone 15 3/13/2023 Galaxy S24 Snapdragon 8 Gen 3 processor will be significantly more powerful than the Snapdragon 8 Gen 2, with the Galaxy-specific version of the chipset set to beat Apple’s upcoming A17 Bionic “on paper.” global market for SiC power devices will climb to around $5.33 billion in 2026 3/13/2023 EVs and renewable energy will remain the two largest application segments at that time. The value of the market for SiC power devices used in EVs is forecasted to rise to US$3.98 billion in 2026, with the CAGR for the 2023~2026 period coming to around 38%. Keysight expands its EDA solutions portfolio through acquisition of Cliosoft. 3/13/2023 Keysight will add Cliosoft’s line of hardware design data and intellectual property (IP) management software tools to its EDA solutions lineup. Environmental Impact of Flexible Electronics Can Be Reduced by Almost 90% 3/13/2023 Environmental impact could be reduced by 86% when additive printing methods are used to create flexible electronic components. sureCore offers ultra-low power memory IP for use at the most popular industry nodes 3/10/2023 “Customers invariably want a certain amount of customisation to precisely fit their project’s needs,” says sureCore CEO Paul Wells, “however, we have found that certain memory configurations keep coming up time and again because similar projects will have the same memory requirements. Intel and Merck fund sustainable semi manufacturing 3/10/2023 Potential solutions could include, environmentally friendlier materials, more efficient use of resources, AI-based solutions for modeling chemical processes, and opportunities for waste and emissions reductions. Envision Energy is adopting Analog Devices Inc.’s MEMS sensor technology in smart-wind turbines 3/10/2023 Initial goals for the collaboration include enabling new levels of wind turbine safety through enhanced real-time monitoring of vibration, tilt, and other information that can be used to inform safer windmill operation and design. 5 Critical Considerations for Connected Health Manufacturers 3/10/2023 The hospital of today bears little resemblance to its predecessor of just a few short decades ago, with internet-enabled medical equipment and devices now a central part of diagnosing, treating, and monitoring patients." Intel seeks more funds from Germany to support wafer fab plans 3/9/2023 Intel Corp. is seeking an additional €4 billion to €5 billion in subsidies from the German government to move ahead with a chip manufacturing complex in the eastern part of the country, Global Semiconductor Sales Down 5% in January 3/9/2023 Global semiconductor industry sales totaled $41.3 billion during the month of January 2023, a decrease of 5.2% compared to the December 2022 total of $43.6 billion and 18.5% less than the January 2022 total of $50.7 billion, according to the Semiconductor Industry Association (SIA). Inventory Correction in Final Phase for Notebook PC Panels in 1Q 2023 3/9/2023 TrendForce estimates that shipments of display panels used in notebook (NB) computers will total 38.7 million pieces for the first quarter of 2023 (1Q 2023), showing a quarter-on-quarter (QoQ) decline of 10.4% and a year-on-year (YoY) decline of 45.6%. Chipletz selected Siemens semiconductor packaging technologies 3/9/2023 The company’s Smart Substrate products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Arm may be able to raise $8 billion on U.S. IPO 3/8/2023 Arm is expected to confidentially submit paperwork for its initial public offering in late April, the sources said, speaking on condition of anonymity because the discussions are confidential. The listing is expected to happen later this year and the exact timing will be determined by market conditions,  95  |  96  |  97  |  98  |  99  |  100  |  101  |  102  |  103  |  104

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