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Intel to focus away from PC 11/24/2003
Most of his company's R&D spending would go toward the technology underlying wireless handheld devices, consumer electronics, and components of the communications infrastructure.
Micro robot can fly 11/24/2003
Epson developed the robot to demonstrate its homegrown micromechatronics technology. The robot consists of a 2.5 gram control module with two CPUs; a 1.3-gram Bluetooth module; a 1.3-gram sensor unit with a gyro-sensor, an accelerometer and an image sensor.
AMD 90nm production delay 11/24/2003
There has been a "two or three month slip" for the volume ramp of the 90-nm process, he said during a conference call with analysts. The AMD executive also outlined the company's 300-mm plans. As reported, the company set plans to build a 300-mm, 65-nm fab in Dresden, Germany. Production is set for 2006.
SST to take part in personal e'ID drive in China 11/24/2003
The Chinese government is embarking on a massive, nationwide program that would issue IC-based identification cards to its citizens. Yeh believes those cards will require anywhere from 0.5Mbit to 1Mbit of embedded flash.
Quarter Million High-Tech Jobs to be loss for 2003 11/21/2003
The U.S. high-tech sector is set to lose 234,000 jobs in 2003 on top of a calamitous 540,000 jobs lost in 2002, according to the American Electronics Association
Samsung launched Window Based Mobile Handset 11/21/2003
Microsoft showcased cell phones equipped with Windows Mobile
NEC offers 8X DVD Drive 11/21/2003
NEC will start shipping the industry's first 8x-speed recordable DVD drives for personal computers next month.
Samsung samples new Network DRAMs 11/20/2003
Samsung Electronics is readying its new DRAM line for networking-specific applications.
500,000 High-Tech jobs were lost in 2002 11/20/2003
The U.S. high-tech sector lost 540,000 jobs in 2002 with over half of the layoffs occurring in the electronics manufacturing sector
Technology Leaders anticipates market recovery at Comdex 11/20/2003
Technology leaders gathered at the annual Comdex trade show here note that semiconductor sales are rising again
HP set to compete in Copier Market 11/20/2003
HP announced plans to enter the $24 billion copier business with new multifunction printing machines and software for managing them over corporate networks
China develop new Video Format 11/19/2003
China has announced a government-funded project to promote an alternative to DVDs and 'attack the market share' of the global video format
Amkor develop new packaging for memory cards 11/19/2003
Amkor Technology has introduced a new packaging technology for game, memory, and I/O cards, which is less expensive than traditional methodologies.
AMD gets German Goverment Loan to build Fab 11/19/2003
The German government has agreed to provide loan guarantees to AMD to build a new fab in the eastern city of Dresden.
IBM unveiled new 64bit Blade-Server 11/19/2003
IBM announced it will use its 64-bit PowerPC 970 processor in a new blade server.
Hynix sue EU for unfair Tarriffs 11/19/2003
Hynix filed a lawsuit last week against the European Union claiming that the EU Commission's imposition of hefty import duties on its chip exports is unfair.
Bill Gates announced Next Generation Windows at Comdex 11/18/2003
Spam, security and getting high-tech devices to communicate with each other are among the major challenges for the technology world, Microsoft's Bill Gates said at the annual Comdex technology convention
The new Comdex Show 11/18/2003
The new Comdex this year, a re-designed show seems less about glitz and more about business.
Sun ink deal to supply one million PC to Chinese goverment 11/18/2003
Sun Microsystems has announced it will signed a deal with the Chinese government to supply to a million Linux desktops over the next year
AMD to build 2nd Fab in Germany 11/18/2003
AMD may have decided where to build its 2nd chip Fab in Dresden, Germany
Nvidia samples fastest graphic chip 11/18/2003
Nivida announced its fastest graphics processor slated for mobile PCs applocation.
HP/Princeton invents Plastic Memory 11/17/2003
Engineers at Princeton University and Hewlett-Packard Laboratories have invented a combination of materials that could lead to a low-cost, compact write-once,ROM
Infineon ink Dram supply contract with Ramaxel 11/17/2003
Infineon will supply DRAM chips to Ramaxel in a five-year deal that could yield $300 million in sales.
Celestica opened second manufacturing Plant in China 11/17/2003
Celestica Inc have announced it has opened a manufacturing facility in Suzhou, China, supported by more than 1,600 employees
AMD introduced 2.2Ghz Opteron CPU 11/17/2003
AMD has introduced three higher-performing Opteron server processors, which now support a fast memory standard
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