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| Samsung Delivers Next Generation Memory Modules |
3/21/2005 |
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Samsung Electronics announced sample production of the next-generation memory module for servers and workstations - a fully buffered, dual in-line memory module (FB DIMM) based on DDR2 technology
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| PC's to game at 64bit |
3/18/2005 |
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And now that 64-bit computing is finally expanding from the game space into the PC space, gamers who prefer that platform will soon be able to take advantage of it as well. But before they can, Microsoft must release its long awaited 64-bit version of Windows, due next month.
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| 300mm continue to ramp |
3/18/2005 |
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Today, Tokyo-based Sumitomo Mitsubishi Silicon Corp. said it would expand production capacity of 300mm wafers to 600,000 wafers per month by summer 2008, up from its current capacity of 300,000 wafers per month.
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| Tin wisker might delay RoHS schedule |
3/18/2005 |
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The $250 million Galaxy 4 communications satellite shut down in its cold, empty space orbit. Engineers believe the cause was tin whiskers growing under the extreme pressures of space. When the whisker grows long enough, it can break off and create a short circuit.
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| Freescale set test center in Japan |
3/18/2005 |
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Freescale intends to use key test data and analytical results from the Nagoya to contribute to its global quality initiatives and further improve its quality levels.
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| Intel delays answer to FTC Japan |
3/18/2005 |
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JFTC has been conducting an antitrust probe against Intel since last April. The agency searched several locations, including Intel Japan's headquarters. It also interviewed two competitors and five major Japanese PC manufacturers: Fujitsu, Hitachi, NEC, Sony and Toshiba.
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| China to build DTV on MIPS core |
3/17/2005 |
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MIPS Technologies Inc. reported today that custom video chip provider Huaya Microelectronics Ltd. has licensed its MIPS32 4Kc SMIC 0.18-micron hard core to develop digital television (DTV) products for the China market.
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| SMIC to pull up ramp on 300mm tool |
3/17/2005 |
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The news prompted many industry watchers to speculate that if SMIC doesn't get the loan to purchase equipment from U.S. suppliers, it may turn to other sources of funding and suppliers, namely Japanese giant Tokyo Electron Ltd., the no. 2 supplier of process equipment behind Applied.
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| Rambus to establish design center in India |
3/17/2005 |
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With 10 engineers now, the center is to be scaled up to 50 by the year-end, the company said. This center would start with a focus on developing cells and cores based on the company's technologies in the areas of PCI Express and DDR2 memory controller designs.
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| WTO expected to rule in favor of Hynix |
3/17/2005 |
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The 25-nation bloc within the WTO failed to prove Hynix received an illegal state subsidy when Korean banks gave it loan guarantees, according to the report.
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| Samsung wants to be MP3 King |
3/17/2005 |
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Samsung roadmap which had the Korean electronics giant securing a 25 percent to 30 percent of the global market for MP3 players in 2007, accompanied by 50 percent to 55 percent of the domestic market.
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| Kevin Martin to lead the Federal Communications Commission |
3/17/2005 |
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Martin, who was named by Bush to the FCC in 2001, had previously served as Special Assistant to the President for Economic Policy at the White House. He took over that post following a stint as deputy general counsel for Bush's 2000 campaign team.
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| AMD announced new strategy on embedded market |
3/16/2005 |
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The new program will feature five-year life cycles plus two years of end-of-life support.This offering will provide embedded customers with eight-way-, two-way-, and uni-processor configurations that use the latest Opteron products and the extended life cycle the customers have been seeking.
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| Semi Fab boom in China |
3/16/2005 |
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By 2008, China would only be able to meet about 35 percent of its needs. "By that time, If we assume $300 billion for the entire world in semiconductor revenue, then China alone will consume over 20 percent of the world's production. So therefore, China needs more fabs,"
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| Cell industry looking into 4G |
3/16/2005 |
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Currently, 3G service such as Verizon Wireless' 1xEV-DO provide typical speeds of between 300 Kbps and 400 Kbps. Nokia demonstrated High Speed Uplink Packet Access (HSUPA), which it said provides speeds of as high as 5.8 Mbit/s.
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| Philips announce breakthrough in phase-change memory |
3/16/2005 |
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This is 100 to 200 times faster than the time required to program a Flash memory cell. This makes the line-cell phase-change memory attractive as a DRAM replacement for certain applications, Philips said.
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| Asustek diverse into auto electronics |
3/15/2005 |
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Auto-electronic sales channels have long been controlled by big European and American companies. To overcome the obstacle, Asustek has commissioned the company's chief technology officer to steer related business development.
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| In-Stat: Field Configurable to grow |
3/15/2005 |
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The report forecasts future market growth and examines consumption of six functional categories by geographic region, along with comparisons of end-use consumption of this technology by geographic region.
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| HP looks at molecular switch in place of transistor |
3/15/2005 |
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"We have a three-pronged approach: fundamental scientific research into the quantum effects that dominate the nanometer scale, a new architecture that can tolerate defects in molecular-sized circuit components and cost-effective methods of fabrication."
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| Infineon rises in semiconductor rank |
3/15/2005 |
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In terms of the top-10 chip makers for 2004, Intel was first in terms of worldwide sales, followed by Samsung, Texas Instruments, Infineon, Renesas, STMicroelectronics, Toshiba, TSMC, NEC, and Philips, according to market research firm IC Insights (Scottsdale, Ariz.). The list also includes silicon foundries, according to the firm.
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| Infineon rises in semiconductor rank |
3/15/2005 |
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In terms of the top-10 chip makers for 2004, Intel was first in terms of worldwide sales, followed by Samsung, Texas Instruments, Infineon, Renesas, STMicroelectronics, Toshiba, TSMC, NEC, and Philips, according to market research firm IC Insights (Scottsdale, Ariz.). The list also includes silicon foundries, according to the firm.
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| SMIC solved DRAM process snag at Beijing fab |
3/15/2005 |
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By February SMIC had hit a snag, and was having more difficulties than expected trying to find a common toolset to do both the 110-nm trench capacitor technology used by Infineon and the 100-nm stacked capacitor preferred by Elpida.
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