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Taiwanese DRAM makers gave bullish outlook 12/19/2006
PowerChip Semiconductor Corp. of Taiwan and Japan's Elpida Memory Inc. last week announced a joint venture to build what the companies billed as the world's largest memory fab in the Central Taiwan Science Park.
Hynix released 60nm DDR2 chips 12/18/2006
Hynix Semiconductor unveiled high capacity modules based on its 60nm 1Gbit DDR2 DRAM chips. This new memory is aimed for high performance graphic and mobile markets.
Matsushita to mass-produce heat-proof batteries 12/18/2006
Matsushita Electric Industrial said on Monday it aims to mass-produce spark-resistant batteries.
BenQ closed Beijing R&D center 12/18/2006
BenQ Corp. will close its cell phone R&D center in Beijing that will result in laying off of about 400 engineers.
Super Micro to go public 12/18/2006
Super Micro has filed initial public offering papers with the U.S. Securities and Exchange Commission.
Work group to set battery safety standards 12/15/2006
Updated safety standards for laptop batteries should be in place within the next 12 months, a working group of computer firms has said.
Mears say it can go to 22nm channel 12/15/2006
"Our technology can be added to strained silicon, SOI or even bulk CMOS, and the other technologies can fit right alongside ours over the next five or ten years as they become ready for production."
Gartner predicts DRAM market to wind down 12/15/2006
Gartner expects growth to slow significantly to 15 percent in 2007, when DRAM is expected to enter into oversupply conditions during the first half of the year. Gartner does expect the second half of next year to be a period of undersupply, however. The firm projects DRAM revenue to peak in 2008, before beginning to decline in 2009.
TwinMOS introduced overclocker DDR2 DIMMs 12/14/2006
TwinMOS Technologies introduced the brand new TwiSTER DDR2-850 CL5 over-clocking DRAM modules after previously announced TwiSTER DDR2-800 CL5 and TwiSTER DDR2-1066 CL5 last month. So the 3 kinds of overclocking modules make TwiSTER series are specially designed to meet the demanding hardware requirements of over-clockers, advanced game players, and enterprise users.
Are Nanotubes ready for production? 12/14/2006
Applications include low-resistance nanowires in integrated circuits, semiconductor nanotubes for fabricating high performance transistors, micro-miniature heatsinks, ultra-tough polymer composites, gas sensors and light sources for flat panel displays.
Atmel move towards fabless 12/14/2006
Atmel will seek to sell its wafer fabrication facilities in North Tyneside, U.K. and Heilbronn, Germany. Through a combination of voluntary resignations, attrition and other actions, Atmel expects a reduction in its non-manufacturing workforce of approximately 300 employees, and anticipates manufacturing headcount to be reduced by approximately 1,000.
AMD commits to fusion chips 12/14/2006
With Microsoft Corp.'s release of its Vista operating system, computer users will see "the biggest change in a 3-D graphics-rich environment," The OS will, in turn, create a host of new 3-D applications that demand "increased performance-at-watt-per-dollar processors,"
SMIC delays project due to lack of fund 12/14/2006
Local media reported that the scale of the Chengdu project was being reduced, with used equipment being substituted for new equipment. Reports also claimed that SMIC was pushing out the schedule for its new 300-mm wafer fab in Shanghai because of a lack of funds.
Micron strengthens image sensor: acquired Avago division 12/13/2006
The move complements Micron’s existing presence in the CMOS image sensors market, giving the company an additional 2.5 percent stake.
Samsung to provide Low Power DRAM for Mobile applications 12/13/2006
Samsung said it expects OneDRAM to be introduced in handsets by the second half of 2007.
Microsoft drives for Robot standard 12/13/2006
Tandy Trower, who helped launch the first versions of Windows, said Microsoft hopes it can spawn a host of applications for robots as it did for PCs.
EMBC to set benchmark test standard for multi-core processor 12/13/2006
Industry now has no quantitative benchmark to measure issues such as scalability and energy efficiency of multicore processors in applications such as data mining, recognition and synthesis.
Triple investigation LG Philips on anti-trust 12/12/2006
Korean Fair Trade Commission visited LG Philips offices in Seoul, Korea. In addition, the Japanese Fair Trade Commission issued a notice to the company's offices in Tokyo, Japan, and the United States Department of Justice issued a subpoena to offices in San Jose.
Semi equipment to be strong on Q2 12/12/2006
"Checks with the major DRAM memory manufacturers in Taiwan suggest that Q2 2007 orders have the potential to be strong provided that the manufacturers follow through with their aggressive ramp plans for 2007,"
ITC upheld that Qualcomm infringed on Broadcom IP 12/12/2006
In October, Bullock found that the patent had been infringed and confirmed the validity of all three patents cited in Broadcom filings. On Dec. 8, the full commission rejected Qualcomm's challenges.
3G is not moving as TI wants 12/12/2006
TI (Dallas) said it expects semiconductor revenue to be between $3.28 billion and $3.42 billion, down from previous guidance of $3.39 billion to $3.66 billion.
HP settles phone tap case for $14.5M 12/11/2006
HP noted that there was no finding of liability against it as part of the settlement, which includes an injunction and agreement that the California Attorney General will not pursue civil claims against HP or against its current and former directors, officers and employees.
ON Semi sue Samsung for infringement 12/11/2006
ON alleges that Samsung knowingly infringes ON patents covering the circuit and method of timing data transfers among others.
Intel ready to part its NOR business? 12/11/2006
An un-named private equity institution is at an advanced stage of preparing to acquire Intel's and STMicroelectronics' NOR flash businesses. Due diligence process is already at an advanced stage and an announcement may be made "in the near future."
New material found for non-volatile memory 12/11/2006
IBM, Macronix and Qimonda claimed that they have developed a phase-change memory prototype that boasts switching speeds at more than 500 times faster than traditional flash-memory technologies. It is also said to use less than one-half the power to write data into a cell.
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