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Samsung invest in multi-core DSP firm 9/18/2007
Samsung invests $27 million in the D-round for funding fabless chip vendor picoChip (Bath, England).
Non Profit group raised laptop price to $188 9/17/2007
The One Laptop per Child Foundation's XO laptop price has been rasied to $188 from its original planned $100 price tag, said foundation spokesman George Snell.
NAND flash contract prices fall 9/17/2007
NAND flash contract prices dropped in September for the first time since June, said DRAMeXchange.
Flash memory makers charged with price fixing 9/17/2007
A class action suit has been filed against SanDisk Corp. and 23 other companies over alleged price fixing for NAND flash memory devices in the market.
Microsoft antitrust appeal rejected by European court 9/17/2007
Microsoft suffered a major setback in Europe as the Luxembourg-based European Court of First Instance rejected almost all the substantive arguments in its its appeal to annul the antitrust decision made in 2004 by the European Commission.
More price pressure expected on PC silicons 9/14/2007
Price is expected to remain aggressive throughout the end of this year, projecting that just before Christmas, buyers will be able to purchase a dual-core MPU for less than $100.
PC overall market to increase 9/14/2007
Strong growth during Q2 showed not only relentless adoption of consumer portable PCs, but also gains in desktop and commercial markets.
Qualcomm stay court decision on import ban 9/14/2007
The wireless chip supplier said the U.S. Court of Appeals for the Federal Circuit's stay pending appeal would allow third parties such as Motorola Inc, Samsung Electronics and LG Electronics MobileComm U.S.A. Inc to import certain handsets into the United States.
JEDEC Standard group creates new eMMC spec for Flash cards 9/14/2007
Endorsing the proposed spec are Micron Technology, Inc., Nokia, Samsung Electronics, Sony Ericsson, Spansion Inc., STMicroelectronics and Texas Instruments. The UFS standard is expected to be completed in 2009.
300mm production cross over to occur 2008 9/13/2007
According to SEMI, the crossover, when 300mm capacity exceeds 200mm capacity will occur in 2008.
Main stream DRAM to transition from 512Mbit to 1Gbit 9/13/2007
A senior official of Samsung Electronics said, “We are planning to increase the proportion of 68 nanometer 1GB DRAM production to 30~40% by the end of this year. Also, in the first half of next year, 1GB DRAM production will become the main unit, accounting for more than 50% of the total manufacturing volume.
IBM promise single SOI chip mobile phone 9/13/2007
IBM Corp. today unveiled CMOS 7RF silicon on insulator (SOI), a semiconductor manufacturing process aimed at allowing single-chip radio frequency (RF) devices through the integration of multiple RF/analog functions such as multi-mode/multi-band RF switches, complex switch biasing networks, and power controllers.
SEC cracks down on accounting fraud 9/13/2007
The United States' governmental authorities continue to crack down on various forms of accounting fraud within the tech industry.
Samsung moves to 60nm on DDR2 9/12/2007
It will start mass production of the new DDR2 DRAMs, which boast faster data-processing speed and consume less power than ordinary DRAMs.
Samsung's semi chief to look for Flash partnership in Taiwan 9/12/2007
Samsung is trying to prevent a repeat of previous NAND flash oversupply and price slumps sparked by decreased orders from Apple, the sources added.
Turbulence detection system being tested 9/12/2007
Alerts are sent to pilots giving them advance notice and presenting alternative routes that enable pilots to thread paths between turbulent regions without changing their arrival times.
Infineon starts gradual withdraw from Qimonda 9/12/2007
Infineon has submitted an offer to sell 25 million ADSs from its own shareholdings, with an additional option of up to 3.75 million additional ADSs.
300mm Flash fab to start production in December 9/11/2007
Latest 300mm wafer fabrication facility is expected to start mass production in December 2007 and reach a production capacity of 80,000 wafers a month in the second half of 2008
iPhone will evolve into 3G 9/11/2007
There is no doubt a 3G version of Apple's iPhone could be announced soon. There is also speculation that Apple will announce the Wideband-CDMA 3G capable version of the phone when it finally reveals European launch of the handset.
Counterfeit handset runs wild in China 9/11/2007
BDA estimates the illegitimate-handset market in China at 20 million units, or roughly 15 percent of the handsets sold in the country in 2006. At iSuppli, the estimates are higher: Teng puts the 2007 gray market at 60 million units.
AMD delivers Barcelona quad core 9/11/2007
AMD, meanwhile, claims Barcelona provides a 50 percent performance increase over its own dual-core chips. Compared with Intel's previous Xeon 5345 CPUs, AMD said, Barcelona delivers performance boosts of 7 to 70 percent, depending on the application.
Hynix achieved 48GB Flash on MCP 9/10/2007
Hynix Semiconductor has reportedly developed a 1.4-millimeter thick multi-chip package (MCP) with 24 stacked NAND flash memory chips.
Taiwan quakes damaged undersea cable 9/10/2007
Chunghwa Telecom, Taiwan's top telecommunications carrier, said an undersea cable to Japan was damaged and was under repair.
China narrows down to 2 mobile TV standards 9/10/2007
CMMB is based on a hybrid satellite and terrestrial network, originally developed by China's Academy of Broadcast Science and Sarft. TDMB is a mobile TV standard using China's home-grown 3G mobile telecommunication standard, TD-SCDMA
Intel starts construction on Dalian Fab 9/10/2007
Intel's China fab was originally announced in March. The $2.5 billion project is set to be operational in 2010. Fab 68 will cover 163,000-square-meters of factory space and host a 15,000-square-meter clean room.
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