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Freescale initiated ITC investigation on broad infringement 7/1/2014
"The products at issue in this investigation are integrated circuits and products containing the same, including wireless communication devices, wireless phones, televisions, optical disk players, tablets, and other products," the bipartisan trade panel said in a statement.
GM victum compensation will have no limit 7/1/2014
Feinberg, the country's eminent compensation expert, said GM has placed no limit on the total amount he can pay to injured people or relatives of those killed. And he alone — not GM — will decide how much they each will get, even though he is being paid by the company.
Toyota car of the future is on hydrogen fuel 7/1/2014
The FCV will travel approximately 300 miles on a single fill-up of hydrogen, which takes less than five minutes.
Google to push on with modular smartphone 7/1/2014
"Why choose a phone for its camera when you can choose a camera for your phone? Why not share the most expensive sensor or component among friends, family, or perhaps across a village?"
LED driver orders up 6/30/2014
Total shipments from Taiwan's LED driver IC vendors to China are likely to double in 2014 from the previous year as more makers have stepped into the low wattage LED driver IC segment.
Chinese government to replace IBM servers in China's banking ? 6/30/2014
After more than 30 years of providing China's banking sector with high-end servers and other technology, IBM is holding out hope that the quality of its products and the strength of its business relationships will shield it from any decision that tempts its clients to look elsewhere for replacement technology.
Alliance Memory enters DDR3 DRAM production 6/30/2014
Samples of the DDR3 and DDR3L SDRAMs are available with lead times of six to eight weeks for production quantities.
Google's Tango tablet to go 3D sensing 6/30/2014
The Project Tango Development Kit will be made available this summer. A location sensing and mapping program required used no GPS, WiFi or Bluetooth to map a user's location.
Midsize manufacturing executives are optimistic on hiring 6/27/2014
In 2014, industrial sector executives report that they are already coming off a strong year but expect even better results over the next 12 months. While an already-healthy majority of executives (69 percent) reported increases in domestic sales over the past year, 88 percent expect the next 12 months to bring further growth,
Triple digit growth on smart devices while PC retreats 6/27/2014
Smartphone demonstrated a 244 per cent increase that issued from cheaper handsets and data tariff reduction, while the notebook recorded a 55 per cent growth that bested market predictions.
Honda cars to be compatible with Android 6/27/2014
To initiate Android Auto, Honda drivers will simply connect their compatible Android smartphone to the vehicle's USB port using the cable that came with their phone, allowing them to intuitively access supported apps and features using the car's in-dash display and voice controls.
Wearable key also monitor your suroundings 6/27/2014
Integrated sensors include a 2-in-1 proximity + ambient light sensor, optical UV sensor, MEMS accelerometer and gyroscope, piezoresistive barometric pressure sensor, ultra-high sensitivity MI (magnetic impedance) sensor and RGB sensor.
Chips for server systems - Qualcomm in, Samsung Nvidia out 6/26/2014
Samsung recently decided to drop the server chip effort and discontinue work being carried out by a team in Milpitas, Calif. Another company leaving the server-chip push to others, at least for the moment, is Nvidia.
FDA want nanotech companies to consult with them on new products 6/26/2014
"We are taking a prudent scientific approach to assess each product on its own merits and are not making broad, general assumptions about the safety of nanotechnology products,"
Intel losing position in cellular base band processor 6/26/2014
For the first time in the last three years, Intel dropped out of the top-three baseband revenue share rankings as its 2G and 3G baseband shipments declined sharply in 1Q14.
IBM to keep processor design and fab 6/26/2014
"The latest Power 8 processors have four times more threads and twice the memory bandwidth of the desktop-derived processors [from Intel]. That gives us an advantage for the new workloads coming. To get those advantages we have to design our own microprocessors... and to build those processors we have to advance the state of process technology in areas like lithography and [circuit] characteristics."
Taiwan's 3S and Skymedi to develope eMMC v4.51 controller 6/25/2014
Solid State System (3S) and Skymedi both have geared up efforts to venture into the eMMC controller market amid high demand for the controller chips from the smartphone and tablet sectors,
Japanese government has new stretagy to spur growth 6/25/2014
The plan, approved by the Cabinet earlier in the day, includes dozens of proposed changes to labor regulations, government pension fund investments, corporate governance and tax policies that Abe says are needed to spur corporate investment and innovation.
US consumer confidence up 6/25/2014
More Americans are optimistic about business conditions and the outlook for jobs, though fewer expect their incomes will grow over the next six months.
Hybride Memory Cube uses Xilinx 15G I/O 6/25/2014
The Xilinx UltraScale devices support the full HMC bandwidth of four lanes, comprised of 64 transceivers running up to 15Gb/s.
Manufacturers to expand NAND production regardless of potential infringement 6/24/2014
Toshiba announced in early June that it had filed a suit with the Intellectual Property Court in Taiwan against Powerchip Technology, Powerflash Technology, Zentel Electronics and CTC Company for infringement of Toshiba's Taiwan patents on the production of NAND flash memory products.
Oracle aquires Micros Systems 6/24/2014
Oracle said the acquisition will extend its offerings by combining Micros' industry-specific applications with its business applications, technologies and cloud portfolio.
Apple to hit market with multiple wearable devices 6/24/2014
Cook indicated the second half of the year will be packed with new products and new product categories. The products almost certainly include revised iPhones and iPads, and the new product category will be Apple's first wearables.
Wafer thinning enhances 3D semiconductors 6/24/2014
The length of the wiring between upper- and lower-layer chips is reduced to below 1/10 compared to conventional TSVs, with wiring resistance, capacitance, and volume being reduced drastically. It is expected to realise applications in ultra-small, Terabit-generation large-scale memory.
Numbers shown that US has a chance to regain manufacturing 6/23/2014
The U.S. has among the lowest labor costs in the industrialized world and is awash in cheap energy, making it attractive for businesses to reshore by bringing their operations back to the U.S.
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