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SK Hynix jumps ahead to supply LPDDR4 chips 2/11/2015
The low-power double data rate 4, an 8-gigabit dynamic random access memory mainly produced for mobile phones and digital cameras, has been installed in LG's G Flex 2, the curved-style handset that hit local shelves in late January.
12 way MEMS switch for LTE-A 2/11/2015
Performance, of capped switches made in industrial foundries, is -0.2dB insertion loss and -45dB isolation at 2GHz. Typical linearity of high throw-count switches is claimed to be >90dBm
Qualcomm to pay $975 million for violating China’s antimonopoly 2/11/2015
But the Chinese market — and the potential for profit — is just too big for companies to ignore. Settling the investigation, Qualcomm said, sets the stage for future growth.
Robots to push labor costs down 2/11/2015
Robots will cut labor costs by 33 percent in South Korea, 25 percent in Japan, 24 percent in Canada and 22 percent in the United States and Taiwan. Only 10 percent of jobs that can be automated have already been taken by robots. By 2025, the machines will have more than 23 percent.
More applications deveoped for drones 2/10/2015
Both Google and Amazon have been experimenting with the use of drones for rapid delivery of goods, BP is using drones for oil pipeline inspection, and drones are helping farmers monitor vast acres of cropland as well as assess growth characteristics so as to better target fertilising and watering efforts.
Spanson to develope 3D NAND 2/10/2015
3D NAND is expected to grow at a compounded annual growth rate of over 180 per cent by 2018. The increase in memory requirements and demand for low form factors for NAND flash is contributing to this growth.
Qualcomm to pay $1 billion to settle antitrust in China 2/10/2015
While heavy fines are on the table, the results of the antitrust investigation may also have far-reaching consequences -- for example, Qualcomm's "reverse patent license" practice may be targeted and Chinese officials may attempt to force Qualcomm to change its business model.
Is Cuba ready for manufacturing? 2/10/2015
A strong manufacturing sector is unlikely to develop without aggressive action on a number of fronts, including domestic investment, inward investment, trade, workforce development, and access to capital markets.
NAND Flash Overall Quarterly Revenue Increased by 2% in 4Q14 2/9/2015
However, Samsung, Toshiba and SanDisk respectively faced pressures such as competitive pricing and end-market demands.
TSMC to invest $16B to build new fab 2/9/2015
TSMC is increasing spending this year to boost production and win orders amid increased competition with Samsung Electronics Co. The company produces chips for Apple Inc.
New solar cell achieved 21.5% record efficiency 2/9/2015
The record-setting research cell was constructed at the company's Perrysburg, Ohio manufacturing factory and research & development centre using processes and materials suitable for commercial-scale manufacturing.
Toshiba /SK Hynix to explore on non-imprinted lithograph for next generation 2/9/2015
NIL transfers the circuit design directly, by impressing a patterned template onto the wafer. This has the potential to achieve finer designs.
Matured 14nm process helped Samsung to secure Apple A9 2/6/2015
Samsung's facilities are better equipped to offer these things than the factories of TSMC, which is currently having a hard time with its 16nm process.
TI to convert 300mm DMOS6 to analogue productions 2/6/2015
TI is converting part of its 13-year-old DMOS6 factory to support $3 billion of 300-millimeter analog revenue from space that had been used for wireless products the company no longer makes,
High U.S. currency cost deficit amd jobs 2/6/2015
"Currency manipulation acts as a subsidy to all Japanese exports, and a tax on U.S. exports to Japan, and all countries where U.S. firms compete with Japanese products,"
West Coast portworkers about to shut down 2/6/2015
Without a new contract, employers could begin a lockout in as soon as five days, or as many as 10 days.
Global mobile phone shipments surpassed the half-billion-units 2/5/2015
Global mobile phone shipments grew seven per cent annually from 481.5 million units in 4Q13 to 515 million in 4Q14. It was the first time worldwide mobile phone shipments have exceeded a half-billion units in a single quarter.
Qualcomm holds major design wins for Snapdragon 810 2/5/2015
Qualcomm officials have said that more than 60 "premium-tier mobile devices" will be powered by the Snapdragon 810, and that they expect more design wins to pop up during the year.
Samsung packages DRAM/Nand to mount on top of processor 2/5/2015
The newly launched ePoP for smartphones can be grouped into a package with APs and take up as much as 40 percent less space, allowing for slimmer handset designs.
Additional Manufacturing Hubs are in Obama's budget 2/5/2015
Overall, the administration's proposal would allocate $350 million in the Agriculture, Commerce, Defense and Energy departments to fund the new hubs, with $1.9 billion in funding for the 29 hubs comprising the remainder of the network.
Component shipment delay postpones shipment of photonic server 2/4/2015
The original batch of modules, which was supposed to ship at the beginning of the year, failed to meet Intel specifications and quality requirements.
Linear to provide battery management IC for EV cars 2/4/2015
At the heart of the BMS is a battery monitoring integrated circuit (IC). This IC measures individual cell voltages which are used to determine state of charge and battery stack health.
New SIA chief optimistic on semi industry 2/4/2015
The global semiconductor industry posted record sales of $335.8 billion in 2014, up 9.9 per cent from 2013, according to the World Semiconductor Trade Statistics, the SIA reported Monday. DRAM performed particularly well, increasing by 34.7 per cent over the prior year.
Intel improved shipment on tablet app processor 2/4/2015
Apple was the leader with 30 per cent revenue share, followed by Intel with 19 per cent and Qualcomm with 14 per cent in tablet processor.
ChipMOS and Accretech to develope backend automations 2/3/2015
Under the agreement, ACCRETECH will be responsible for the equipment design and manufacturing. This is expected to include, but will not be limited to, probers for wafer testing and wafer dicing equipment. ChipMOS will provide engineering resources for development, testing and evaluation.
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