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| 3D QLC NAND can be a memory game changer |
7/28/2017 |
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QLC flash works with existing 3D technology, essentially doubling the available storage. Western Digital and Toshiba have already announced their QLC BiCS flash-memory chips.
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| Great business with ST time-of-flight sensor |
7/28/2017 |
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ToF sensor technology is used in proximity and ranging sensors for smartphones. ST’s cumulative shipments for its FlightSense ToF technology have reached 300 million, and they are already in more than 80 smartphone models from 15 OEMs.
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| City of Shanghai set aside $7.4 billion to invest in chip industry |
7/28/2017 |
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The fund will provide CNY30 billion to support the development of the local manufacturing sector, CNY10 billion to help local fabless firms expand via acquisitions, and another CNY10 billion to foster the development of the local equipment and materials sector.
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| Foxconn to put $10 billion display plant in Wisconsin |
7/28/2017 |
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The deal initially includes a 20 million square foot Foxconn campus but could ultimately create up to 13,000 Foxconn and 22,000 indirect jobs. The Foxconn jobs will have an average annual salary of $53,000 plus benefits.
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| SK Hynix's profit up 9 folds |
7/26/2017 |
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Second-quarter net profit shot up nearly ninefold, apparently helped by a strong average sales price of dynamic random-access memory (DRAM) and NAND chips.
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| ARM bets growth on IoT |
7/25/2017 |
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Some 100 billion chips built on ARM Holdings technology will be shipped in the next four years, as many as in the company's entire history so far, thanks to demand tied to the so-called internet of things.
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| Intel surfaces complain on Qualcomm monopoly |
7/24/2017 |
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Intel has now made its own statement, accusing Qualcomm of abusing its monopoly position and not licensing "standard-essential" patents at a fair rate as required by law.
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| China data centers up demand for advanced chips |
7/24/2017 |
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Data center installations are set to surge in China, the demand outlook for new applications, such as Big Data, cloud infrastructure and artificial intelligence (AI), appears promising locally.
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| UFS is wining over eMMC |
7/24/2017 |
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UFS2.1-based NAND flash chips boast the highest data transmission speed of up to 11.6Gbps (1200MB/s) compared to 3.2Gbps (400MB/s) attainable by eMMC5.1 chips. The difference will make UFS2.1 NAND flash chips the mainstream storage technology for smartphones in 2017.
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| Foundries see surge in automotive chips |
7/24/2017 |
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“The recent demand for automotive electronics, such as ADAS, AI, sensor hubs and connectivity, has changed the foundry perspective. The automotive market is wide open now."
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| Siemens built Digitalisation Hub in Singapore |
7/21/2017 |
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Together with Singapore's Economic Development Board (EDB), Siemen's Hub will focus on the country's efforts to become "smart nation," utilising Siemen's IoT operating system MindSphere to drive digitalisation.
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| Qualcomm sales up despite patent entangles |
7/21/2017 |
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For the current quarter, Qualcomm expects earnings from 75 cents to 85 cents a share with $5.4 billion to $6.2 billion in revenue. Wall Street is expecting earnings of 90 cents a share on revenue of $5.48 billion.
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| IC Insight forecasts $419 billion semi sales |
7/21/2017 |
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"The strong annual upturn in sales is being driven almost entirely by fast-rising average selling prices (ASP. Prices for DRAM and NAND first began increasing in the second half of 2016 and continued with quarterly increases through the first half of 2017."
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