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UMC's argument on DRAM technology leak 11/13/2018 In its most-recent statement concerning the indictment, UMC said its DRAM technology is "fundamentally based on a cell design entirely different from Micron's design." China stays on top in Super Computer 11/13/2018 China now has 227 Top 500 supercomputers, 45% of the total, while the U.S total fell to 109 (22%), an historic low. JD.com hit record sales on Singles' Day 11/12/2018 The firm’s 2018 numbers are up 26 percent on last year when it recorded 127.1 billion RMB in GMV — then worth around $19.14 billion. That was the first year that JD went public with its 11.11 sales. ON Semi to show on-board electric vehicle charging with power modules 11/12/2018 On Semiconductor’s booth at Electronica will include demonstrations featuring the new FAM65xxxx modules, as well as addressing applications in areas such as vehicle electrification, autonomous driving and lighting technology. SMIC ventures into FinFET process 11/12/2018 SMIC expects to move its first-generation FinFET process technology to risk production in the first half of 2019. Chinese startup trys to beat Samsung to offer foldable phone 11/12/2018 Royole’s FlexPai tablet is based on its 7.8-inch AMOLED display that folds into the size of a smartphone. The flexible display is in pilot production in a 1.1 million-square-foot fab that will ultimately be able to produce a million 8-inch panels a month. Qualcomm published better-than-expected fourth quarter financial results 11/9/2018 Qualcomm reported non-GAAP earnings of 90 cents per share on revenue of $5.8 billion, down two percent year over year. Wall Street was looking for earnings of 83 cents per share with $5.52 billion in revenue. Xilinx to acquire datacenter network technology 11/9/2018 Buying Mellanox would give Xilinx a broader array of products to sell into the data center market. Samsung is bringing foldable display into the mobile market 11/9/2018 Google said that it will create extensions to the next version of Android for foldable devices. It will also release APIs to support multi-windowing interfaces that Samsung described for its foldable. Texas Instruments ventures into 60GHz mmWave sensor 11/9/2018 Texas Instruments made clear this week its intentions to muscle into the industrial market with a 60-GHz mmWave sensor family. NAND prices dropped 17% in October 11/8/2018 DRAMeXchange noted that 3D NAND flash contract prices for October 2018 alone suffered a monthly fall of 13-17%, marking the biggest decline of its kind ever seen since November 2017. Federal judge orders Qualcomm to license modem technology to competitors 11/8/2018 The preliminary ruling by Judge Lucy Koh in the U.S. District Court for the Northern District of California said that Qualcomm must license some patents involved in making so-called modem chips, which help smart phones connect to wireless data networks, to rival chip firms. AMD to have 7nm CPU/GPU ahead of Intel 11/8/2018 Advanced Micro Devices launched its first 7-nm CPU and GPU at the lucrative target of the data center. It showed working chips. Brexit talks enter into deadlock 11/8/2018 Britain is due to leave the EU on March 29, but divorce negotiations have been hamstrung by divisions within May's Conservative government over how close an economic relationship to seek with the bloc. Reduce fertilizer usage by adding advanced soil sensor 11/7/2018 The bury-and-forget nitrogen sensors will be coupled with remote sensing technologies for real-time analysis of soil health. ON Semiconductor teams with Mercedes on Formula 1 EV powertrain system 11/7/2018 The powertrain systems within both a Formula 1 and Formula E vehicle not only possess an increased number of power semiconductors, these semiconductors must meet extremely demanding performance and efficiency requirements. China now has its own semiconductor wafer crystal furnace 11/7/2018 With government support, China's local silicon wafer suppliers and foundry chipmakers have been pouring significant capital into their capacity expansions. Imagination announced offering of navigation and image compression IP core 11/7/2018 Imagination’s new global navigation satellite system (GNSS) IP offering, the Ensigma Location GNSS IP core, supports GPS, GLONASS, Galileo, and BeiDou as well as several satellite-based augmentation systems (SBAS) including WAAS and EGNOS. Broadcom made billion dollar patent claim against Volkswagen 11/6/2018 Spiegel magazine, which first reported the conflict on Friday, said it concerned the use of 18 patents on Broadcom semiconductors which Volkswagen uses for navigation and entertainment system in some of its cars. Fujian Jinhua denies charges on stealing DRAM technology 11/6/2018 Jinhua said it has been its standing policy to develop its own technology and has been expanding investments, resulting in a number of patent achievements. SK Hynix claims 4D NAND using Charge Trap Flash (CTF) design paired with the Peri 11/6/2018 Mass production of the 96-Layer 4D NAND within this year. A single 512Gb NAND flash chip can represent 64 gigabytes (GB) storage. Regardless of memory prices, global semiconductor sales is to hit record 11/6/2018 “While year-to-year growth has tapered in recent months, September marked the global industry’s highest-ever monthly sales, and Q3 was its top-grossing quarter on record," Amazon in advanced talks to Northern Virginia on HQ2 location 11/5/2018 The discussions include how quickly Amazon would move its employees there, which buildings it would occupy and how an announcement about the move would be made to the public. It’s unclear whether Amazon is having similar discussions with other finalists. Cornami disclosed neural network AI chip 11/5/2018 Cornami aims to supply its chips to numerous markets, including in "edge computing," where automobiles and consumer electronics have an especial need for chips that have very responsive performance and are energy-efficient in how they run neural networks. GlobalWafers' CEO Hsu predicts tight wafer supply ahead 11/5/2018 Demand for 8-inch and 12-inch wafers has been quite strong. GlobalWafers has signed long-term supply contracts with customers, most of which will remain valid through 2020. Contracts for large-size wafers now command 80-90% of her company's existing capacities.  260  |  261  |  262  |  263  |  264  |  265  |  266  |  267  |  268  |  269

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