Home
News
Products
Corporate
Contact
 
Thursday, May 8, 2025

News
Industry News
Publications
CST News
Help/Support
Software
Tester FAQs
Industry News
NXP forms partnership with Foxconn Industrial Internet (FII) to work on automotive technologies 12/20/2021
the joint project will focus on the development of a full-digital cockpit solution, based on the NXP i.MX 8 QuadMax. The platform will include digital clusters, and a head-up display (HUD) system, which will enable global automotive OEMs and tier-1s to deliver vivid in-vehicle experiences for their customers.
Samsung regains top spot in smartphone sales 12/20/2021
Samsung was able to increase its shipments by shifting products quickly from its manufacturing facilities in Vietnam to stakeholders further down the channel. But other OEMs found it tough to tackle the ongoing component shortages and, overall, both offline and online channels faced low supplies. All this helped Samsung recapture the top spot with a 23% share in the key Southeast Asia countries.
Siemens and LG Energy Solution signs cooperation on battery manufacturing technologies 12/17/2021
The two companies plan to take steps to promote the process of battery manufacturing intelligence at LGES production facilities worldwide.
MediaTek claimed that its supply for next year is largely in hand 12/17/2021
“In terms of supply challenges, I think MediaTek has done pretty well on this front,” MediaTek Vice Chairman and Chief Executive Rick Tsai told a news conference. “We have already nearly prepared our supply for next year.”
Samsung began volume production for automotive memory 12/17/2021
Samsung is in volume production of memories designed for automotive applications including a 256GB PCIe Gen3 NVMe ball grid array (BGA) SSD, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for high-performance infotainment systems, as well as 2GB GDDR6 DRAM and 128GB Universal Flash Storage (UFS) for autonomous driving systems.
Memory and storage requirements will spur chip demand in the 5G world 12/17/2021
P>Leading semiconductor and component suppliers in areas like memory chips and storage arrays are focusing on the opportunities presented by the 5G expansion, designing and manufacturing wireless devices capable of operating at new frequencies. New devices will also be able to process and store significantly more data than previous generations of cellular technology.
SK hynix samples DDR5 memory chips 12/16/2021
SK hynix said Wednesday it has shipped samples of 24-gigabit DDR5 dynamic random access memory chips, touting its technology leadership in commercializing a single DRAM chip that has the largest density in the industry. DDR5.
2021 ends up with $103 billion in IC equipment sales 12/16/2021
IC equipment sales surged 44.7% from the previous industry record of US$71 billion in 2020, according to SEMI. The growth is expected to continue with the global total semiconductor manufacturing equipment market expanding to US$114 billion by 2022.
An open approach to FPGA development 12/16/2021
An open approach to FPGA development is emerging as promoters seek to foster an open-source ecosystem of development tools that will extend the technology.
TSMC's N4X process targets at High Performance Computing applications 12/16/2021
N4X is the first of TSMC’s HPC-focused technology offerings, representing ultimate performance and maximum clock frequencies in the 5-nanometer family. The “X” designation is reserved for TSMC technologies that are developed specifically for HPC products.
STMicro introduces next generation STPOWER silicon-carbide (SiC) for EV applications 12/15/2021
With the acceleration of the EV market many car makers and automotive suppliers are now embracing 800V drive systems to achieve much faster charging and help reduce EV weight, producing vehicles with longer driving ranges.
Flexible Ultra-Thin Memory Device for wearable applications 12/15/2021
An ultra-thin memory device materialized with a 2D nanomaterial of several nanometers (nm) can significantly increase the memory density,
Zero emissions Autonomous E-Container Ship 12/15/2021
The emission-free and safe energy supply is provided by a 6.7 MWh battery system with integrated liquid cooling to ensure optimum operating temperature.
SEMICON Southeast Asia 2022 to take place in Penang 12/15/2021
SEMICON SEA 2022 will shine a spotlight on the supply chain disruptions that have battered the semiconductor industry, as well as an increased emphasis on environmental and sustainability challenges that industry players need to grapple with.
Broadcom delivered record revenues in the third quarter 12/14/2021
Broadcom offered guidance for fourth-quarter revenue of approximately $7.35 billion. Analysts surveyed by FactSet are projecting fourth-quarter sales of $7.2 billion.
IBM and Samsung claim they’ve made a breakthrough in 1-nanometer threshold 12/14/2021
The two companies unveiled a new design for stacking transistors vertically on a chip. With current processors and SoCs, transistors lie flat on the surface of the silicon, and then electric current flows from side-to-side. By contrast, Vertical Transport Field Effect Transistors (VTFET) sit perpendicular to one another and current flows vertically.
DRAM shipment forecast on 2022 declining 12/14/2021
PC OEMs’ DRAM inventory has lowered by several weeks, TrendForce has also further reduced its forecast of DRAM price drops for 1Q22. Even so, the overall demand for DRAM will still enter a cyclical downturn in 1Q22, during which DRAM ASP will also maintain a downward trajectory with an 8-13% QoQ decline.
Magnachip Semiconductor to terminate merger agreement with Wise Road Capital 12/14/2021
This course of action resulted from the inability of the parties, despite months of effort, to obtain CFIUS’s approval for the merger. In connection with the termination of the merger agreement,
EV market drives demand for 6 in wafers 12/13/2021
Demand from the global automotive market for 6-inch silicon carbide (SiC) wafers is expected to reach 1.69 million units in 2025 thanks to the rising penetration rate of EVs and the trend towards high-voltage 800V EV architecture, according to TrendForce.
Murata teams with Michelin to develop tire management system 12/13/2021
The companies ae to co-developed a new generation of RFID modules that are embedded into tires. The robust passive RFID tags require no external power supply and will continue to operate while being driven on for extremely high mileages.
Intel unveils comeback plan 12/13/2021
At IEEE International Electron Devices Meeting (IEDM) 2021, Intel outlined its path toward more than 10x interconnect density improvement in packaging with hybrid bonding, 30% to 50% area improvement in transistor scaling, major breakthroughs in new power and memory technologies, and new concepts in physics that may one day revolutionize computing.
Memory sales boosted up global semiconductor revenue in Q3 12/13/2021
Preliminary data shows the NAND market reached nearly $18.7 billion in 3Q21,” said Craig Stice, Omdia’s chief semiconductor analyst. “The NAND market was fueled by strong shipment growth to meet demand coming out of the enterprise and data center markets, as well as stable demand out of the smartphone market.”
TI offers tiny 24-bit wideband ADC chip in 3mm square leadless package 12/10/2021
Designers can use wideband mode to improve AC measurement resolution with 50% wider bandwidth, data rates as high as 400 kSPS, and a 30% higher signal-to-noise ratio than competing data converters, while minimizing noise at high frequencies.
Qualcomm executive moved to join AI computer vision startup MemryX 12/10/2021
Kressin has become chief executive of MemryX, founded in 2019 by University of Michigan professors Wei Lu and Zhengya Zhan. MemryX is working on its second generation of a chip aimed at helping cameras in places such as cars and factory robots recognize objects, a field called computer vision.
Power management IC prices jumped 10% 12/10/2021
Due to factors such as production running at full capacity and a shortage of raw materials, PMIC suppliers have currently announced longer lead times with consumer electronic IC lead times increasing to 12~26 weeks, automotive IC lead times reaching 40~52 weeks, and a cessation of orders for certain exclusive production models.
 130  |  131  |  132  |  133  |  134  |  135  |  136  |  137  |  138  |  139 

CST Inc. Memory Tester DDR Tester
Copyright © 1994 - 2023 CST, Inc. All Rights Reserved