Silicon Box has joined imec’s Automotive Chiplet Program (ACP), a collaborative initiative focused on accelerating adoption of chiplet technologies for next-generation vehicles. The move reflects increasing industry emphasis on chiplet-based architectures to address rising compute demands, cost pressures, and supply constraints in software-defined automotive systems.

Under the ACP, Silicon Box will contribute end-to-end capabilities in chiplet interconnection, including architectural consulting, advanced packaging, and testing. The company will collaborate with ecosystem partners to develop interoperable chiplet solutions aligned with automotive requirements for safety, reliability, performance, and thermal management.

Key areas of contribution include defining interconnection protocols for automotive chiplet interoperability and supporting advanced packaging R&D to ensure compliance with automotive-grade quality targets. The effort is intended to de-risk chiplet integration and accelerate scalable deployment across vehicle platforms.

“The ACP is a huge step forward for the rapidly growing chiplet ecosystem, because it means that the automotive industry…has recognized the benefits of chiplet technology and is making a commitment to accelerate development and adoption at scale,” said Dr. Byung Joon (BJ) Han, co-founder and CEO of Silicon Box, in a statement. “Chiplet technology is gaining traction within the automotive chip industry for its potential to shorten time-to-market, ensure stable supply and reduce development costs.”

“Advanced packaging technology can enable seamless, flexible interconnections between chiplets for version upgrades and to support the high-density interconnections required by advanced automotive systems,” said Mike Han, chief revenue officer at Silicon Box.

Silicon Box said its participation will further align its roadmap with emerging chiplet standards. The company is currently co-developing automotive-grade chiplet packages for advanced driver assistance systems (ADAS) and recently received an IATF 16949 Letter of Conformance. Automotive revenue grew at an annualized 436% rate in the first quarter of 2026.

At imec, the ACP brings together more than 22 partners across the automotive and semiconductor value chain. “We are delighted to welcome Silicon Box to our program, as their involvement enables us to accelerate progress and mitigate risks in the transition towards a fully interoperable chiplet-based ecosystem,” Bart Plackle, Vice President Automotive at imec, said in a press statement.

By: DocMemory
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