As power, sensing, and embedded systems converge to enable smarter, more connected electronics, Texas Instruments (TI) continues to demonstrate its leadership through breakthrough semiconductor technologies.

At this year’s EE Awards Asia, TI claimed multiple top honors, including Best Power Semiconductor of the Year, Best Sensor of the Year, and Best MCU/Driver IC of the Year, alongside a Five-Year Achievement Award recognizing its sustained excellence in automotive solutions. Now in its fifth year, EE Awards Asia celebrates the contributions and innovations of Asia’s electronics engineering community by honoring outstanding products, companies, and engineers.

Each winning device highlights TI’s ability to translate deep analog and embedded expertise into practical innovation, advancing energy efficiency, miniaturization, and intelligence across key application domains.

Redefining power density

Named Best Power Semiconductor of the Year, TI’s UCG28826 power IC introduces the industry’s first self-biasing operation, a technical breakthrough that eliminates the need for the transformer auxiliary winding and its associated power circuitry.

This auxless architecture simplifies design and lowers overall cost while achieving a power density of over 2.8W/cm³. The device’s highly configurable design also makes it easier for engineers to achieve high efficiency and EMI compliance.

Targeted at up to 65W AC/DC consumer power supplies, the UCG28826 is designed for next-generation fast-charging applications, such as cellphone and notebook chargers, USB wall outlets, industrial power rails and server aux power supplies. In a market where compact form factors and energy efficiency are critical, TI’s self-biasing innovation sets a new standard in power conversion design.

Enabling longer-range, safer lidar systems

In the sensing category, TI’s LMH13000 received a Best Sensor of the Year award for advancing lidar performance in automotive and robotics. As the industry’s first integrated high-speed lidar laser driver, it enables faster, more accurate decision-making with an ultra-fast 800ps rise time, allowing lidar modules in automobiles and autonomous robots to detect objects up to 30% farther than discrete lidar solutions.

By integrating control interfaces (LVDS, CMOS, TTL) while eliminating the need for external FETs or large capacitors, the LMH13000 reduces solution size by up to 4x and lowers system cost by an average of 30%, enabling more compact and affordable lidar architectures for broader vehicle adoption.

By limiting variation over temperature to just 2% versus the 30% typical in traditional solutions, TI’s LMH13000 enables the system to meet Class 1 FDA eye-safety compliance. As automotive and industrial automation systems demand faster and more precise perception, TI’s sensor innovation enables more accurate detection and quicker reactions to obstacles, traffic and road conditions, helping advance safety.

World’s smallest MCU

Receiving a Best MCU/Driver IC of the Year honor, TI’s MSPM0C1104 MCU demonstrates the company’s commitment to meeting engineers’ design needs by delivering continuous innovation across its MCU portfolio. Measuring just 1.38mm²—roughly the size of a black pepper flake—it is the world’s smallest MCU. Leveraging TI’s wafer chip-scale packaging (WCSP) technology, the MCU is 38% smaller than competing devices.

The device integrates high-speed analog components and maintains robust processing performance, allowing designers to add more functionality to their systems while optimizing board space and cost.

The MSPM0C1104 is part of TI’s pin-to-pin compatible Arm® Cortex®-M0+-based MSPM0 MCU portfolio, allowing engineers to scale from small to large designs using a single portfolio. Key applications for the device include medical wearables, personal electronics such as earbuds and stylus pens.

Achievement award

TI also received a Five-Year Achievement Award as a Featured Automotive Electronics Solutions Supplier, marking its fifth consecutive year of recognition for leadership in the automotive semiconductor domain.

TI’s technologies support four critical automotive areas – including ADAS, hybrid and electric vehicle powertrains, body electronics and lighting, and infotainment and cluster systems. With a broad range of analog and embedded processing chips, TI empowers engineers to tackle complex challenges in automotive design, including the shift to 48V architecture and SDVs. TI technology and design resources help engineers reduce system cost and complexity and accelerate the development of next-generation vehicles.

This recognition reflects TI’s long-term commitment to innovation, quality, and reliability in the automotive sector. Backed by decades of expertise, system-level support, and dependable capacity, TI continues to help its customers design safer and more affordable vehicles.

Trends driving chip innovation

Reflecting on five years of consecutive recognition, TI observes several macro trends driving semiconductor innovation:

* Data and Intelligence: AI models running in data centers and edge applications are unlocking the potential for automated intelligent systems. This is driving a shift toward higher levels of power density to meet data center requirements. For localized data processing, innovative embedded processors are enabling real-time operation and creating demand for higher power efficiency and performance at the edge.

* Automation: Automation is transforming industries, from manufacturing and robotics to smart buildings. These systems require more precise control, intelligent sensing, reliable communication, and real-time processing to improve productivity, safety, and energy efficiency.

* Automotive Transformation: Vehicle electrification, SDV architectures, and ADAS are redefining how vehicles are designed, with greater emphasis on functional safety, power density, and real-time intelligence.

* Sustainable Energy: The global focus on renewable energy is driving the need for more efficient power delivery, system stability, and scalability, accelerating innovation in solar power, energy storage, EV charging, and grid systems.

In response, TI continues to advance power semiconductor technologies—particularly GaN-based devices—to achieve higher integration and power density. The company is also investing in a scalable edge AI portfolio that allows engineers to innovate and embed intelligence into their systems, enhancing their real-time decision-making.

Designing and manufacturing innovative products has been at the core of TI’s business for decades. To meet the steadily growing demand for foundational analog and embedded processing chips, TI is building on its legacy of technology leadership and expanding its global manufacturing footprint to support the next wave of technological breakthroughs.

The semiconductor industry is now entering a phase where smarter systems and energy efficiency are becoming core design priorities. The next breakthroughs will come from integrating edge AI, advanced power management, and high-voltage technologies, enabling machines, vehicles, and energy systems to make real-time decisions with greater precision and lower power consumption.

With a broad portfolio of more than 80,000 analog and embedded processing products, TI is well positioned to help engineers innovate across growing markets and create smarter, more sustainable systems for the future.

By: DocMemory
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