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UMC, Polar sign memorandum on US wafer production


Monday, December 8, 2025

Taiwanese chipmaker United Microelectronics Corp (UMC) has signed a memorandum of understanding with US-based Polar Semiconductor to explore collaboration on manufacturing eight-inch semiconductor wafers in the United States.

Under the agreement, the two companies will identify products to be produced at Polar’s recently expanded eight-inch fabrication facility in Minnesota. The initiative aims to meet growing demand from sectors including automotive, data centres, consumer electronics, and aerospace and defence.

The partnership will combine Polar’s domestic manufacturing capabilities with UMC’s established eight-inch technology portfolio and global customer network. According to both firms, the move could strengthen multi-sourcing strategies for customers and enhance supply chain resilience amid geopolitical uncertainties.

“This partnership is aligned with Polar’s strategy to meet the growing demand for domestic manufacturing,” said Ken Obuszewski, Polar’s vice president of marketing. Oliver Chang, UMC’s senior vice president of global sales, added that the collaboration “directly addresses our customers’ needs for more made-in-USA chips.”

UMC, Taiwan’s second-largest contract chipmaker after TSMC, operates most of its fabrication plants in Taiwan, with additional facilities in Japan and Singapore.

By: DocMemory
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