xMEMS Labs’ xMEMS Live Asia seminar series will return this September 16 in Taipei and September 18 in Shenzhen. Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.

This year’s one-day seminars will center on live product demonstrations of Sycamore, xMEMS’ revolutionary thin and lightweight full-range MEMS loudspeaker, and µCooling, the world’s first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can’t go.

In addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and µCooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics.

“AI is changing how we interface with devices while also increasing processor and thermal loads,” said Joseph Jiang, CEO of xMEMS Labs. “At xMEMS Live Asia, we’ll demonstrate how Sycamore and µCooling technologies are enabling a new generation of thinner and lighter weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance.”

By: DocMemory
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