The aftermath of the COVID-19 epidemic combined with multiple geopolitical events, have posed challenges to the global economy. Simultaneously the China region faced challenges in the real estate sector, and these too are having an ongoing impact. The semiconductor industry is not immune to the uncertainties in the global economic climate, and the situation has led to a shortage of raw materials, impacting semiconductor supply chains.

As we look towards 2024, the industry is navigating these challenges and seeking areas of growth and resilience. Molex acknowledges the complexities and our focus is on adjusting to change and fostering collaboration with customers and partners across international boundaries. As a global manufacturer, we place emphasis on adaptability and resilience. We are committed to navigating challenges collaboratively, seeking solutions to supply chain disruptions, and fostering innovation in emerging application fields.

In challenging times, experience matters

For 80 years, Molex has been driving innovation in electronics, supporting industries from Automotive to Healthcare and Consumer to Data Communications. Understanding trends and market shifts is a critical requirement to driving mutual benefit for Molex and our customers.

Molex believes our ability to respond to issues is what counts. And we have proven we are equipped to deal with a multitude of challenges, be they geopolitical, economic or otherwise. Molex has survived and thrived over the last eight decades, and this ability to remain steadfast in our commitment to customer innovation, combined with our global design and manufacturing footprint reflects our determination as a company to ensure continuity of supply to our customers to minimize financial impact to their businesses and to reduce the recovery time in the event of a disruption.

Real-time monitoring, assessment and response to global risks requires processes and skills. Supply chain resilience and agility are critical to our customers’ operations and time-to-market schedules. In practical terms, this means we leverage the latest tools and technologies–as well as real-time data–to ensure both our company and customers are prepared for the unexpected. We are optimizing international and domestic freight and shipping methods and, most importantly, mitigating risk in the global supply chain.

By the end of this year, Molex is projecting a 50% increase in the accuracy of our on-time deliveries. To realize such an increase required a significant change in how we aligned our demand, inventory and supply planning to the realities of our daily operations. To drive this goal, we started by developing and implementing an entirely new program for Molex Global Sales and Operations Planning and Execution (GSOP&E), that includes a cross-functional decision-making process that considers financial, operational and marketplace impacts. Our ultimate objective is to provide our customers with the most favourable outcome.

The practical application of groundbreaking technology is driving transformation

At Molex, we firmly believe that the technology of the future is only possible through connectivity. From factory floors and hyperscale data centers to self-driving vehicles and smart, energy-efficient homes, connectivity innovations are shaping the technology future. Every step forward requires cross-disciplinary engineering, world-class manufacturing, and constant collaboration with customers to push the boundaries of high-speed, high-power connectors.

Leading-edge connectivity is the cornerstone of new products and solutions found in every industry and application. To help product designers and engineers in the fast-paced semiconductor sector prepare for what lies ahead, Molex considers these innovations to be most important.

Next-generation, contactless connectivity solutions

Contactless connectors use miniaturized radio frequency (RF) transceivers and receivers to enable devices to communicate and exchange data without requiring physical contact between them. They also support much higher data rates than existing wireless protocols, such as Bluetooth and Wi-Fi. Its reliability and durability advantages over physical, metal-to-metal contacts make contactless connectors ideal for video displays, harsh environments, sleek and light consumer electronics, as well as industrial robotics. The pace of development in this area is gaining momentum as companies realize its potential in term of cost and application value.

Molex recently introduced the MX60 series of contactless connectivity solutions. These low-power, high-speed, solid-state devices feature miniaturized mmWave RF transceivers and built-in antennas in one complete package for faster, simpler, device-to-device communications without the use of physical cables or connectors. As a result, MX60 solutions offer greater product design freedom, seamless device pairing and increased communications reliability.

Vehicle-to-everything (V2X) communications

Ongoing developments in antennas, sensors and connectors are among the most important enablers in vehicle-to-everything (V2X) capabilities. Backed by a decade-long roadmap of 5G V2X projects and established industry leadership in shark-fin antenna development, Molex has set a steady pace of innovation in support of advanced driver assistance systems (ADAS) and self-driving vehicles. Close collaboration with automakers and suppliers is essential to define optimal antenna placement and performance. Additionally, advancements in non-conductive materials will allow future connected vehicles to incorporate seamless designs without sacrificing connectivity to satellites, Wi-Fi networks and other systems.

The tremendous growth in automotive infotainment and safety options is also a catalyst for car manufacturers demanding smaller interconnects from suppliers, as they need to fit more electronics in the same space. Mini50 sealed and unsealed wire-to-board receptacles allow device manufacturers to package circuits in tighter spaces by utilizing smaller pin, terminal, and wire sizes while reducing costs. Additional advancements in interconnect for zonal architecture includes MX-DaSH Data Signal Hybrid Connectors designed for compact connectivity in an ECU domain controller/computer. Instead of taking up precious design real estate with multiple connectors, engineers can meet multiple connectivity needs within one compact connector.

Connected, energy-independent homes

Tomorrow’s connected homes will combine Internet of Things (IoT) functionality with battery storage systems to ensure greater control and visibility over energy production and usage. Innovations in energy management, such as mini-inverters for solar panels and smart battery management systems, will improve energy-usage efficiency and control. These storage systems are expected to play a crucial role in intelligent monitoring and power routing systems.

Centralized, hyperscale hubs of connectivity

Hyperscale data centers built on 224G system architectures will enable Artificial Intelligence (AI) to help consumers optimize energy consumption, while empowering businesses to keep pace with relentless requirements for real-time data processing. The rapid adoption of generative AI is forcing hyperscale data centers to evolve, prompting Molex to pioneer 224 Gbps-PAM4 architecture. Molex’s first-to-market 224G product portfolio offers unparalleled flexibility and scalability, along with superior signal integrity and robust mechanical composition.

Industrial automation solutions

Changes in consumer behavior and expectations of rapid availability have forced manufacturers to adopt new industrial automation techniques. Industrial manufacturing is an essential part of modern life. All the products that we take for granted, from domestic appliances to the latest robots, rely upon an efficient and responsive manufacturing industry for delivery. This is key in our region as industrial automation systems—including robots, machine-to-machine communications and machine learning—help create the smart factory, which is facilitating faster times to market and improving responsiveness to changing demands. To successfully address these issues, customers require comprehensive connectivity innovations that can deliver high performance and reliability in the toughest conditions.

In a dynamic world that constantly pursues innovation to produce compelling innovation, the fundamental element that remains paramount is reliability. Our recent global survey, of system architects and design engineers, (including more than 30% of respondents based in Asia) affirms this perspective. Reliability is gauged by the consistency and adherence to performance expectations throughout a product’s life cycle. Recognizing and prioritizing reliability is crucial for the semiconductor space, as well as other technology sectors, not just to meet but to surpass customer expectations.

The survey also revealed anticipation for the future. Digital technologies, including AI, machine learning (ML) simulations, and advanced analytics are anticipated to wield a positive influence on reliability. In a landscape marked by uncertainties, prioritizing reliability emerges as a guiding principle to navigate the complexities and challenges of our times.

Molex’s commitment to customer experience remains our top priority, no matter the challenges happening across in the world. By deeply understanding the needs of our customers, we strive to drive mutual benefit for all our valued customers.

By: DocMemory
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