Huawei is expected to have 60% of its phones powered by Hisilicon's APs in the second half of 2019, compared with 45% in the first half of the year and less than 40% in the second half of 2018, according supply chain sources.

This means that over 150 million Huawei handsets will adopt Kirin mobile SoCs rolled out by its chipmaking arm Hisilicon, based on the total shipments of 270 million units projected for 2019, the sources said.

Meanwhile, Huawei founder and CEO Ren Chengfei said in a recent Tencent Technology report that despite already owning comprehensive chipset solutions for its handsets, the company will continue to purchase mobile SoCs from Qualcomm. And industry sources said that Huawei's mobile AP purchases from Qualcomm in 2019 will not be lower than 50 million units recorded in 2018.

The sources said Hisilicon's Kirin APs have competed fiercely with Qualcomm's Snapdragon 8 series platforms in recent years, but Huawei has still purchased lower-end APs from Qualcomm, such as Glory 8 series adopting S636 and S660 APs and smartwatches and notebooks also incorporating Qualcomm and Intel AP supplies.

Huawei Hisilicon's second version of 7nm Kirin 810 AP launched in June has been incorporated to the firm's mid-range handsets, in an apparent move to ease its reliance on Qualcomm and MediaTek for the supply of lower-end mobile SoCs, the sources indicated.

By: DocMemory
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