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AMD uses caution in selecting 7nm fab, partners

Monday, January 14, 2019

AMD has unveiled recently its 7nm CPU and GPU lineup designed for high-performance PCs, gaming and data center applications. The new processor series are all reportedly being fabricated by Taiwan Semiconductor Manufacturing Company (TSMC).

TSMC is also among the backend partners of AMD for its new 7nm computing and graphics products, according to industry sources. Siliconware Precision Industries (SPIL) under Taiwan's ASE Technology Holding, and China-based Tongfu Microelectronics (TFME) are other backend service providers for the chips, the sources continued.

TSMC with its CoWoS (chip-on-wafer-on-substrate) packaging has grabbed orders for AMD's 7nm datacenter CPU, while SPIL and TFME share the flip-chip packaging orders placed by AMD for its new 7nm CPU and GPU designed for desktops and notebooks, the sources indicated.

TFME (formerly Nantong Fujitsu Microelectronics) through its acquisition of an 85% stake in AMD's Penang, Malaysia and Suzhou, China ATMP (assembly, test, mark, and pack) facilities has allowed the China-based company to win part of the orders for AMD's new 7nm processors, the sources identified.

"2019 will be an inflection point for the industry as we bring these new products to market," said AMD president and CEO Lisa Su when announcing the company's first 7nm CPU and GPU. "From our 7nm Radeon graphics chips to our next-generation 7nm AMD Ryzen and AMD EYPC processors, it's going to be an exciting year for AMD and the industry."

By: DocMemory
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