Tuesday, May 10, 2005
Tezzaron Semiconductor Inc. and startup Programmable Integrated Circuit Co. (PICC) announced plans to collaborate on the creation of three-dimensional (3D) flash memory components.
Under the terms, PICC will license Tezzaron's technology to develop 3D-based flash-memory devices. PICC claims that these components will exhibit much higher capacity and consume less power than current flash parts.
PICC (Mountain View, Calif.), a new fabless semiconductor company, develops flash technology based on vertical storage cells. Its patented Vflash technology builds vertical flash cells that occupy much less space than standard flash cells.
Tezzaron (Naperville, Ill.) owns 3D stacking technology. Its patented FaStack technology builds 3D chips by stacking whole semiconductor wafers and bonding them with copper to create connections between the circuitry layers.
PICC's Vflash memory designs will be produced on standard bulk semiconductor wafers. These wafers will be stacked and vertically interconnected with Tezzaron's FaStack process, said James Ayers, chairman and CEO of Tezzaron.
"We see great potential in 3D flash because of its speed, density, and low power requirements," he said. "Layered flash can achieve much higher memory capacity in the same footprint, so it will allow designers to use fewer memory chips and markedly reduce the power requirements."
The companies intend to extend their association in order to create additional 3D devices, he added.
By: DocMemory
Copyright © 2005 CST, Inc. All Rights Reserved
|
Email Article
Printer Format
Previous
