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Sunday, March 18, 2018
Industry News
Qualcomm raise offer for NXP as a defence against Broadcom 2/21/2018
It could strengthen Qualcomm’s defenses because it allows its shareholders to better assess the standalone value of Qualcomm as an alternative to a deal with Broadcom.
What is Broadcom to get off the proposed Qualcomm merger? 2/21/2018
Financial analysts agree that the $121 billion deal is in the best interests of stockholders for the short-term. But long-term, they say that it’s bad for the industry and that Broadcom’s growth-by-acquisition model will not be sustainable.
Amazon use discounts, cash back benefits, and speedy delivery times to boost Wholefood sales 2/20/2018
Amazon is hoping discounts, cash back benefits, and speedy delivery times will encourage Prime members to make all of their grocery purchases at Whole Foods. Amazon may be an online retail giant, but the grocery market is difficult to break into and even more difficult to dominate.
NAND flash memory chip prices expected to stabilize 2/20/2018
ASP is forecast to fall to $0.24 this year and further dip to $0.15 in 2019 before reaching $0.08 in 2021, equivalent to one quarter of last year's price.
China anxious to break into memory industry through massive spending 2/20/2018
China must develop most of the technology itself. But it’s difficult to play catch-up in the competitive memory market against the multinationals such as Intel, Micron, Samsung, SK Hynix, Toshiba and Western Digital.
class action lawsuits against Intel forSpectre and Meltdown issue 2/20/2018
The companies have issued fixes but some patches slowed down computers, leading sector analysts to say producers could potentially face suits from clients and consumers claiming damages because their devices did not work as they should.
iPhone 11 will be more affordable 2/19/2018
Apple will release an improved version of the iPhone 11 that will still be rather affordable. This smartphone will feature a 6.1-inch screen, yet will retail at a price point of just $699.
EUV lithography challenges the semi industry 2/19/2018
As chip makers start using EUVL in fabs--scanner uptime (mostly related to source), lack of commercial actinic patterned mask inspection tools and readiness of EUV mask pellicles will challenge their future.
Ellie Yieh at Applied Materials highlight challenges in processing industry 2/19/2018
There is fragmentation of memory technologies with the emergence of STT-MRAM and 3D XPoint memory. So there is no shortage of challenges in enabling advanced performance, and all of them require new materials.
ON Semi offers 2D and 3D CMOS image sensor 2/19/2018
ON Semi says the depth mode will enable depth mapping concurrently, while shooting video at 30 fps. The device has been designed to empower innovative industrial and consumer end-product applications with its 3D features.
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