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Wednesday, September 19, 2018
Industry News
AT&T downgraded on concern of complex Warner merger 8/29/2018
There are “many new balls to juggle (and invest in) with Time Warner assets,” the analysts said. “Entering a new sector by owning media content, AT&T is destined to learn maintaining the content machine (and the talent behind it) is not inexpensive.”
Majority of semi Capex goes to Memory in 2018 8/29/2018
The total for NAND capex would represent an increase of 13% over 2017, when NAND flash capex grew by 91%. Meanwhile, the report forecasts that capital spending for DRAM and SRAM will increase more than any other industry segment, growing 41% in 2018 after an 82% increase last year.
Globalfoundries to skip 7nm process 8/29/2018
It would have cost GF $2-4 billion to ramp up the 40-50,000 wafers/month capacity needed to have a chance of making a return on the node.
Lattice Semiconductor selects former AMD executive as CEO 8/28/2018
Anderson brings a strong combination of business and technical leadership with a deep understanding of Lattice's target end markets and customers.
Toshiba Electronics offers micro-step motor driver 8/28/2018
Toshiba Electronics Europe has announced a new 50V / 5A rated bipolar stepping motor driver that supports 1/128 microstepping.
Former Control Data fab. selected by DARPA for multi-plane semiconductor development 8/28/2018
The Bloomington company for the next three years will help DARPA and MIT engineer and test processes to manufacture chips that have circuitry on more than one plane. In addition, the circuits will vary in type between the two main varieties, memory and logic.
Qualcomm plans operations center in Taiwan 8/28/2018
Qualcomm senior vice president Jim Cathey on Friday last week said that the company is to set up a Center for Operations, Manufacturing Engineering and Testing in Taiwan as a hub for the firm to extend its reach overseas.
Samsung continue to lead Intel in semiconductor production 8/27/2018
Samsung's second quarter share of chip market stood at 15.9%, compared with Intel's 13.9%, according to market research firm IHS Markit.
New physical and spin-electronic properties greatly improves computing and memory efficiency 8/27/2018
“We used a quantum material that has attracted a lot of attention by the semiconductor industry in the past few years. Created it in unique way that resulted in a material with new physical and spin-electronic properties."
Huawei to announce new model phone with 7nm HiSilicon SOC 8/27/2018
The HiSilicon Kirin 980 SoC is reportedly manufactured by TSMC using the foundry's 7nm FinFET process. The SoC features four Cortex-A77 cores along with four Cortex-A55, and 24-core Mali-G72 GPU. It comes with LPDDR4X DRAM memory.
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