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Sunday, March 18, 2018
Industry News
Micron offers new 3D NAND memory system for high end smartphones 2/28/2018
These second-generation 3D NAND storage products, supports the high-speed Universal Flash Storage (UFS) 2.1 standard. Micron's new mobile 3D NAND products are available in 256GB, 128GB and 64GB capacities.
Intel to put embedded 5G modem into some PC 2/28/2018
Dell, HP and Microsoft are working with Intel to ship PCs before the end of 2019 using its XMM 8060 5G modem.
Mobile DRAM revenue pulls back some after seasonal rush 2/27/2018
Global mobile DRAM revenue hit a new high of US$8 billion in 4Q17, a robust sequential growth of 23.6%. In 1Q18, global mobile DRAM revenues are expected to grow slower due to weaker demands on the smartphone market. Most smartphone brands have made adjustments to their production plans and postponed the restocking of materials.
Nanya predicts a good year for DRAM 2/27/2018
gThe industryfs uptrend only kicked off in the second half and is to extend into the whole of this year. The strongest demand comes from servers and data centers.h
South Korea's chip exports up 53% in January 2/27/2018
Exports of semiconductors soared 53.8 percent on-year to $9.86 billion in January. In September last year, exports of semiconductors soared 73.3 percent on-year to an unprecedented $9.88 billion, and subsequently surpassed $9 billion for five months in a row.
Demand for voice command chips to increase 2/27/2018
MediaTek's shipments for voice-assistant devices are expected to surge over 50% on year in 2018, as the chip firm has obtained orders from the world's leading smart speaker vendors, according to the sources.
Xiaomi announced new phone with Snapdragon 845 chipset 2/26/2018
According to previous rumors, the device will come with 8GB of LPDDR4X RAM along with 256GB of high speed UFS storage. A pair of 12MP cameras will adorn the back of the handset and an "under-the-display" fingerprint scanner will be on board.
Huawei announced first 5G chips at Mobile world Congress 2/26/2018
The company claims that its Huawei Balong 5G01 chip is the first to support the new 3GPP standard for 5G networks, and that it should be able to download data at 2.3Gbps.
Top firms spent $35.9 billion in semiconductor R&D in 2017 2/26/2018
The 10 largest semiconductor R&D spenders increased their collective expenditures to US$35.9 billion in 2017, an increase of 6% compared to US$34.0 billion in 2016.
Samsung reported building $6 billion fab with EUV process 2/26/2018
Extreme ultra violet (EUV) lithography equipment will be installed in the plant, which will help Samsung maintain technological leadership in very large scale integrations.
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