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Saturday, November 18, 2017
Industry News
4DS to demonstrate its process with a 1Mbit ReRAM test chip. 11/3/2017
4DS has a development agreement with Western Digital subsidiary HGST to develop interface switching ReRAM based on 4DSí metal oxide hetero-junction operation (MOHJ0) non-volatile memory.
Singapore-based Sesto Robotics offers transport for semi process 11/3/2017
The company has been spending most of its effort studying semiconductor manufacturing processes and procedures for 3-4 years in order to enable its AGVs to coordinate with the transportation processes of the semiconductor industry.
Memory supply will be tight into 2018 11/3/2017
While mature IC parts and components has been strong since the beginning of 2017, the proliferation of IoT/AR/VR applications, cloud services, drone devices, and smart voice assistant products has worsened the shortages
AMS takes NFC into industrial applications 11/2/2017

AMS has launched a NFC tag IC with industrial-grade quality, intended for high-reliability long term use. It combined with an advanced energy harvesting feature, greatly increases battery life time or even allows battery-less designs.

Imagination shareholders approved offer from Cnyon Bridge 11/2/2017
Canyonís founder Benjamin Chow was charged on Monday with insider trading. However, a spokeswoman for Canyon said on Tuesday that the Imagination deal would not be jeopardized by the allegations.
Calls to stop unfair state tax credit to manufacturers 11/2/2017
"We are struck by how awarding benefits to a select group of businesses harms their competitors in California. We also think the resources consumed by the program are not as focused as they should be on winning economic development competitions with other states."
Manufacturing Index continue on growth path 11/2/2017
U.S. manufacturing expanded in October as the PMI registered 58.7 percent, a decrease of 2.1 percentage points from the September reading of 60.8 percent. This indicates growth in manufacturing for the 14th consecutive month and continues expansion consistent with pre-hurricane levels.
Semi sales reach $108 billion in Q3 11/1/2017
The semiconductor industry is almost certain to set a sales record this year, with sales potentially topping $400 billion for the first time, thanks largely to tremendous growth in memory revenue amid tight supply.
Winbond offers secured flash memories 11/1/2017
Winbond announced it was meeting challenges with the expansion of its TrustME Secure Flash products portfolio based on the Trusted Computing Group (TCG) Device Identifier Composition Engine (DICE) Architecture specification, which defines new security and privacy technologies applicable to systems and components.
China firm to invest $2.71 billion to develope 19nm DRAM 11/1/2017
GigaDevice Semiconductor and Hefei RuiLi Integrated Circuit Manufacture (formerly Hefei ChangXin IC) will team up to develop 19nm DRAM process technology for the production of 12-inch wafers at a total investment of CNY18 billion (US$2.71 billion).
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