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Tuesday, January 16, 2018
Industry News
Micron call quit on 3D stack NAND cooperation with Intel 1/9/2018
However, the parting of the ways does not apply to the phase-change based 3D-XPoint memory. The two companies said they will continue to cooperate on 3D-XPoint memory at the Intel-Micron Flash Technologies (IMFT) joint venture fab in Lehi, Utah.
Intel processor to include AMD Radeon graphic core 1/9/2018
The new Core H processors work with High Bandwidth Memory 2 (HBM2), a more power-efficient stacked memory technology that AMD pioneered and has since been turned into an industry standard.
Fabless IC company sales have topped  $100 billion 1/9/2018
Fabless IC suppliers growing faster than the IDMs beginning in 2011 and this trend continued through 2014.
Nvidia believes in alliance to drive automotive chips 1/9/2018
Uber’s self-driving car fleet was using their technology to help its autonomous cars perceive the world and make split-second decisions.
Broadcom takes Qualcomm to Proxy vote challenge 1/8/2018
In November Broadcom made an unsolicited bid to buy Qualcomm for $70 a share. Qualcomm’s board rejected the buyout offer. The rebuff prompted Broadcom to challenge all 11 members of Qualcomm’s board with its own nominees.
Chunghwa Test Technology grows with requirement for 7nm testing 1/8/2018
The company’s latest revenue projection came after it restarted shipping belated orders of 7nm probe cards last month, which helped boost its revenue by 17 percent to NT$167 million last month.
Intel upgrade fixed processor security issues 1/8/2018
Security researchers had disclosed two security flaws exposing vulnerability of nearly every modern computing device containing chips from Intel, Advanced Micro Devices Inc (AMD.O) and ARM Holdings.
The tally is in: Semiconductor sales 2017 reached $419.7billion 1/8/2018
Samsung has overtaken US rival Intel as the world's biggest maker of semi-conductors as sales in the sector boom, a study published by consultancy Gartner showed on Thursday.
Global NAND market to hit oversupply by 2019 1/5/2018
The outlook comes as companies, including Samsung Electronics, Toshiba and Intel, have been announcing plans to expand their production capacities.
OmniVision offers 24M-Pixel image sensor 1/5/2018
OmniVision’s PureCel Plus stacked die 0.9-micron pixel leverages multiple generations of advanced pixel technologies to match the latest 1.0-micron pixel quantum-efficiency performance. This enables higher-resolution pictures and video in a compact form factor.
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