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Monday, September 06, 2010
Industry News
Toshiba ramps up 24nm Nand Flash Chip 8/31/2010
Toshiba announced that it has started mass production of NAND flash memory fabricated with 24nm process technology.
Intel cut price for i7 processors 8/31/2010
Intel recently dropped the price of its quad-core Core i7-950 processors to US$294 from US$562 to defend from AMD's recent price cuts.
Intel to buy Infineon wireless business 8/30/2010
Infineon Technologies and Intel on August 30 jointly announced that they have entered into a definitive agreement to transfer Infineon's Wireless Solutions (WLS) business to Intel in a cash transaction valued at approximately US$1.4 billion
Intel report decline in third-quarter 2010 revenues 8/30/2010
Intel has announced that third-quarter 2010 revenues will be below the company's previous outlook.
TSMC to build Solar Fab in Taiwan 8/30/2010
Taiwan Semiconductor Manufacturing Company (TSMC) plans to break ground for the construction of a new fab at the Central Taiwan Science Park
JEDEC marching on to DDR4 memory 8/27/2010
A basic outline was given of DRAM memory technology evolution from DDR3 to DDR4 over the next few years. Following the recent MemCon 2010 event last month in Tokyo, the site has combined the roadmaps of several DRAM manufacturers in the industry and aggregated them into prediction charts on what they expect DDR4 to offer.
China expanding in uP architecture design 8/27/2010
The heart of the chip is the 64-bit, MIPS-compatible 464V core which sports a superscalar out-of-order pipeline capable of retiring four instructions per clock cycle. It supports 200 instructions to emulate the Intel x86.
Samsung position to overtake Intel in ranking 8/27/2010
South Korea's Samsung Electronics Co. Ltd. is on track to catch Intel Corp. in semiconductor revenue and will most likely become the No. 1 chip vendor by the middle of this decade, according to a prominent semiconductor industry analyst.
Taiwanese delegation to recruite US engineers 8/27/2010
The delegation includes representative from Taiwanese electronics companies, universities and government who are trying to fill 1,000 technician, engineer, researcher and teaching positions in Taiwan, China and the U.S.
Mobile applications push for breakthrough in packaging 8/26/2010
The mobile market is extremely enticing. In the past, standard cell phone technology called for added functionality, decreased size, extended battery life, and lower cost.
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