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Saturday, November 18, 2017
Industry News
Microchip ‘SuperFlash’ memory offers 64Mbit with reduced power consumption 10/18/2017
It supports full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol.
New partnership in MRAM developement 10/18/2017
Spin Transfer Technologies (STT) and capital equipment vendor Tokyo Electron Ltd. (TEL) have entered into a collaborative engineering program to jointly develop process technologies for SRAM- and DRAM-class spin-transfer torque (ST) MRAM devices.
Market outlook for NAND remains unchanged regardless of glitch at Toshiba 10/17/2017
Toshiba will be able to deliver its NAND Flash shipments as per the dates and volumes in its fourth-quarter contracts, says DRAMeXchange.
SMIC appointed new executives 10/17/2017
Semiconductor Manufacturing International Corporation ("SMIC"; the largest and most advanced foundry in mainland China, today announced the appointment of Dr. Haijun Zhao and Dr. Liang Mong Song as SMIC Co-CEO and Executive Director.
China plans to double its 12 inch capacity in 2018 10/17/2017
Shanghai Xinsheng is scheduled to come online at the end of 2017 with monthly capacity of 150,000 12-inch wafers in the first phase, and the monthly capacity will double to 300,000 units by 2020.
Toshiba eager to close the Bain deal while WD is still fighting 10/17/2017
Channels for talks with Western Digital remain open while Toshiba hoped for cordial relations and continued cooperation with the company.
Samsung Electronics CEO resigned 10/16/2017
The surprise resignation of Samsung’s chip and display head came as he was expected to take a bigger role following Lee’s arrest in February and the departures of other key executives in the wake of the bribery scandal.
DRAM manufacturers stock rises 10/16/2017
While demand for DRAM was expected to rise 20.6% next year, chipmakers were only planning to add 19.6 percent in capacity globally, a TrendForce report said
ON Semi released new image sensors 10/16/2017
The new parts provide a complete solution with the new image sensor and processing functionality integrated within a low power system-on-chip (SoC) that simplifies and speeds adoption in applications like rear and surround view cameras.
Toshiba start to order equipment for new fab 10/16/2017
The equipment is for a fabrication facility under construction at the Mie Prefecture plant, in which Toshiba jointly invests with U.S. partner Western Digital.
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