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Saturday, November 18, 2017
Industry News
Samsung to expand V-NAND production in Xian, China 11/17/2017
>"The new facility is scheduled to be put into operation in 2019 and will be used for mass production of V-NAND flash memory."
Oil use to decrease 11/17/2017
Although OECD countries are forecast to have 46 million more cars come 2040, oil demand from these vehicles is going to fall by 4.8 million barrels per day. In contrast, demand in developing countries will increase by 6.5 million.á
Manufacturing has room to grow 11/17/2017
U.S. manufacturing output growth has been concentrated in a few standout areas such as pharmaceuticals, electronics, and aerospace, while most other manufacturing industries have seen slower growth or real declines in value added.
5.4-magnitude earthquake caused no interruption on Korean Semi Industry 11/16/2017
It was confirmed that the earthquake triggered no disruption or damage to semiconductor production lines at Samsung Electronics and SK Hynix.
South Korea'n manufacturers sold record DRAM in quarter 11/16/2017
Samsung's combined sales of DRAM chips came to US$8.7 billion in the July-September period, up 15.2 percent from a quarter earlier. That of SK hynix also shot up 22.5 percent to $5.5 billion.
Nanjing becomes a hot spot for Chinese semiconductor ventures 11/16/2017
Many semiconductor firms have newly announced plans to set up operations in Nanjing Jiangbei New Area, including China's Solomon Systech, and US-based leading EDA players Synopsys and Cadence
Apple is looking to acquire Israel startups for technology 11/16/2017
"We have to have the best technology to differentiate ourselves. We don't make buys to increase workforce and to obtain new talented workers, we do it for the technology."
3D XPoint gets boosted with facility expansion at IM Flash 11/15/2017
The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology.
Leti gets breakthrough on 300mm wafer-to-wafer 3D bonding 11/15/2017
This is the first reported demonstration of sub-1.5Ám pitch copper hybrid bonding feasibility.
China Gigadevice gets help to keep NOR production 11/15/2017
Thanks to support from the government of Mainland China, GigaDevice has newly developed plans to expand production, and support from SMIC has been particularly important. SMIC has pledged to provide 25,000 chips worth of monthly production capacity to GigaDevice for their OEM production of NOR memory.
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