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Friday, February 24, 2017
Industry News
Toshiba samples 512Gbit 3D NAND with 64 layers 2/24/2017
Toshiba is sampling 64-layer 3-bit-per cell 512Gbit 3D NAND.
Exynos 9 is 10 core with 10nm FinFET processs 2/24/2017
Samsung said it plans to apply the new FinFET technology to Exynos 9 which is widely predicted by analysts to be installed in the tech company's next flagship smartphone, the Galaxy S8, scheduled to be released as early as next month.
Over 100 million GPU's shipped in Q4 2/24/2017
Among the big three suppliers, AMD and Nvidia both increased shipments by 10% in the fourth quarter (sequentially), while Intel shipments were down 4%. Discrete GPUs gained market over integrated units.
SK Hynix to bid on Toshiba Semiconductors 2/24/2017
SK Hynix said earlier that it had submitted a non-binding bid for a stake in the business on Feb. 3, without specifying the size of the stake. It will consider a fresh bid should Toshiba make another offer.
Tsinghua Unigroup plans IPO 2/23/2017
Unigroup Spreadtrum RDA, China's top mobile chipmaker which supplies to Samsung Electronics, has been spearheading Beijing's ferocious efforts to cultivate its domestic semiconductor industry to reduce dependence on foreign imports due to economic and security concerns.
Globalfoundries offer 45nm RFSOI process acquired from IBM 2/23/2017
Designers can stack RF FETs in the process to achieve higher power and reliability. Active FETs can be “tuned for very high Ft/Fmax” for mmwave circuits in 5G products and front-ends for car radar.
U.S. Government clears Renesas/Intersil merger to go ahead 2/23/2017
The investigation of the merger transaction under which Renesas will acquire Intersil is complete and that there are no unresolved national security concerns with respect to the transaction.
Supreme Court: U.S. patent law does not cover export of a single component 2/23/2017
The justices ruled unanimously on Wednesday that the company's shipment of a single part of a patented invention for assembly in another country did not violate patent laws.
Foxconn starts massive recruit of college grads in China 2/22/2017
It marks the biggest college recruitment campaign undertaken by the giant electronics firm, which employs more than a million workers in its factories across China.
Micron to complete R & D facility in Boise 2/22/2017
Micron needs space because of a wider product base the company supports globally, including products from former Japanese chip maker Elpida Memory Inc., which Micron bought in 2013.
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